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MC78L12ABDG

Onsemi

MC78L12ABDG by Onsemi

MC78L12ABDG by Onsemi is a fixed positive single output standard regulator with an output voltage of 12V and max current of 0.1A. It operates in temperatures ranging from -40 to 125 °C, making it suitable for various electronic applications requiring stable voltage regulation in compact spaces.

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Bristol Electronics

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Digiode

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ComSIT Distribution GmbH

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Cogito LLC

Ukraine . 514 parts In-Stock

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J2 Sourcing AB

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Sensible Micro Corp

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AZTECH Wire

Italy . 1,174 parts In-Stock

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Microchip USA

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Problanco Electronics

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TANS Electronics

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UHIMA Technologies

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Overview

Experience the superior quality and reliability of Onsemi's MC78L12ABDG fixed regulator. This innovative product offers customers a seamless solution for maintaining a steady output voltage in a wide range of applications. With a compact design and high efficiency, this regulator is perfect for electronic devices where precision and consistency are crucial. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and provides unmatched value to your projects. Upgrade to the MC78L12ABDG and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the regulator.

Operating Temperature (TJ-Max): 125 °C

Ensures reliable operation even in high temperature environments.

Nominal Output Voltage-1: 12 V

Provides a stable output voltage for connected devices.

Maximum Output Current-1: 0.1 A

Capable of delivering ample current for low power applications.

Terminal Finish: Tin (Sn)

Offers good conductivity and corrosion resistance for the terminals.

Technical Specifications

Fixed Regulators - Positive Single Output Standard MC78L12ABDG attributes and parameters. Explore more Fixed Regulators - Positive Single Output Standard devices from Onsemi

Specs

Adjustability:

FIXED

Nominal Dropout Voltage-1:

1.7 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

27 V

Minimum Input Voltage:

14.5 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation:

.25 %

Maximum Load Regulation:

.1 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

12.5 V

Minimum Output Voltage-1:

11.5 V

Nominal Output Voltage-1:

12 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

Width:

3.9 mm

Trade Compliance

MC78L12ABDG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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