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MC74VHC1G135DF1G

Onsemi

MC74VHC1G135DF1G by Onsemi

MC74VHC1G135DF1G by Onsemi is a NAND gate IC with Schmitt Trigger and Open Drain features. It operates at 2-5.5V, has low quiescent current of 1µA, and can drive up to 8mA output. With fast propagation delay of 9.7ns @ 5V, it's ideal for logic applications in temperature range -55 °C to 125°C.

Median Price

$0.079

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

MC74VHC1G135DF1G by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 582 parts In-Stock

1+ parts

-

100+ parts

$0.079

1k+ parts

$0.066

10k+ parts

$0.059

582

-

$0.079

$0.066

$0.059

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,017 parts In-Stock

1+ parts

$0.062

100+ parts

-

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2,017

$0.062

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Vyrian

USA . 4,501 parts In-Stock

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4,501

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Distributors (Availability)

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Corphita

USA . 1,323 parts In-Stock

1+ parts

$0.058

100+ parts

-

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1,323

$0.058

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Corohmni

South Africa . 65 parts In-Stock

1+ parts

$0.065

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65

$0.065

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AZTECH Wire

Italy . 214 parts In-Stock

1+ parts

$14.250

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214

$14.250

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SupplyDigital Components

Austria . 7,841 parts In-Stock

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7,841

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TANS Electronics

Latvia . 5,458 parts In-Stock

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5,458

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Problanco Electronics

Mexico . 4,600 parts In-Stock

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4,600

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Kulean Microsystems

USA . 3,845 parts In-Stock

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3,845

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Microchip USA

USA . 3,218 parts In-Stock

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3,218

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QUARKTWIN TECHNOLOGY LTD

USA . 2,403 parts In-Stock

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2,403

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UHIMA Technologies

Türkiye . 602 parts In-Stock

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602

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Overview

Discover the MC74VHC1G135DF1G by Onsemi, a top-quality NAND Gate with Schmitt Trigger and Open Drain features. Manufactured by Onsemi, this versatile IC is perfect for a wide range of applications in the logic gates and inverters category. With a low quiescent current and fast propagation delay, this product offers exceptional performance and reliability. Trust Onsemi's reputation for excellence and choose the MC74VHC1G135DF1G for your next project to experience unmatched value and benefits.

Feature Benefit Bullets

Other Names: 2156-MC74VHC1G135DF1G-OS, ONSMC74VHC1G135DF1G

Having multiple names makes it easier to identify and source this particular product.

Standard Package: 3,000

Buying in bulk quantity of 3,000 can potentially lead to cost savings.

Category: Integrated Circuits (ICs), Logic Gates and Inverters

Being in the category of ICs and logic gates makes this product suitable for various digital circuit applications.

Features: Schmitt Trigger, Open Drain

The inclusion of Schmitt Trigger and Open Drain features provides additional functionality and flexibility in circuit design.

Voltage - Supply: 2V ~ 5.5V

Wide voltage supply range of 2V to 5.5V allows compatibility with a variety of power sources.

Operating Temperature: -55 °C ~ 125°C

Wide operating temperature range makes this product suitable for use in both extreme cold and hot environments.

Mounting Type: Surface Mount

Surface mount design allows for easy integration onto circuit boards.

Technical Specifications

Additional Parts MC74VHC1G135DF1G attributes and parameters. Explore more Additional Parts devices from Onsemi

Technical Specifications

Other Names:

2156-MC74VHC1G135DF1G-OS
ONSMC74VHC1G135DF1G

Operating Temperature:

-55°C ~ 125°C

Category:

Integrated Circuits (ICs)
Logic Gates and Inverters

Max Propagation Delay @ V, Max CL:

9.7ns @ 5V, 50pF

Logic Type:

NAND Gate

Input Logic Level - Low:

0.65V ~ 1.45V

Mounting Type:

Surface Mount

Supplier Device Package:

SC-88A (SC-70-5/SOT-353)

Standard Package:

3,000

Series:

74VHC

Package / Case:

5-TSSOP, SC-70-5, SOT-353

Voltage - Supply:

2V ~ 5.5V

Input Logic Level - High:

2.25V ~ 3.7V

Number of Inputs:

2

Features:

Schmitt Trigger, Open Drain

Package:

Tape & Reel (TR)

Number of Circuits:

1

Current - Quiescent (Max):

1 µA

Current - Output High, Low:

-, 8mA

Base Product Number:

74VHC1G135

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

MC74VHC1G135DF1G Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.39.0001

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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