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MC74LVXT8051M

Onsemi

MC74LVXT8051M by Onsemi

MC74LVXT8051M by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at a supply voltage range of 2-6V and offers a max on-state resistance of 50 ohm. With a compact small outline package, it is ideal for military-grade applications requiring fast switching times and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,203 parts In-Stock

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Digiode

USA . 1,367 parts In-Stock

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AZTECH Wire

Italy . 524 parts In-Stock

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$12.060

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Component Stockers USA

USA . 730 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,273 parts In-Stock

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Kulean Microsystems

USA . 5,377 parts In-Stock

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Problanco Electronics

Mexico . 5,227 parts In-Stock

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SupplyDigital Components

Austria . 2,818 parts In-Stock

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Corphita

USA . 2,115 parts In-Stock

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Microchip USA

USA . 467 parts In-Stock

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UHIMA Technologies

Türkiye . 438 parts In-Stock

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Corohmni

South Africa . 413 parts In-Stock

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Overview

Discover the cutting-edge technology of the MC74LVXT8051M by Onsemi, a top-of-the-line single-ended multiplexer that offers unmatched performance and reliability. With a military-grade temperature grade and CMOS technology, this small outline package delivers superior functionality in a wide range of applications. From 8 channels to a maximum supply voltage of 6V, this versatile component is designed to exceed expectations. Experience seamless operation, precise control, and enhanced efficiency with the MC74LVXT8051M, setting a new standard for multiplexers and switches in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable which is ideal for portable or rugged applications.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3V is a common and easily available power source, making it convenient for integration into various systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand elevated temperatures without compromising performance.

No. of Channels: 8

Having 8 channels allows for multiple inputs to be switched or multiplexed, increasing the versatility and functionality of the product.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it efficient and reliable for various applications.

Technical Specifications

Multiplexers & Switches MC74LVXT8051M attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.16 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

15 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC74LVXT8051M Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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