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MC74LVXT4066DR2G

Onsemi

MC74LVXT4066DR2G by Onsemi

MC74LVXT4066DR2G by Onsemi is a 4-function multiplexer with 3.3V supplies, 50 ohm Ron, and 25ns switch-on time. Ideal for military-grade applications requiring CMOS technology, it offers separate outputs and -55 to 125°C operating range in a small outline package.

Median Price

$0.884

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

$0.348

100+ parts

$0.328

1k+ parts

$0.296

10k+ parts

-

5,000

$0.348

$0.328

$0.296

-

DigiKey

USA . 11 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

$0.314

11

$1.420

-

-

$0.314

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,732 parts In-Stock

1+ parts

$0.331

100+ parts

-

1k+ parts

-

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1,732

$0.331

-

-

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$0.383

100+ parts

-

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58

$0.383

-

-

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Vyrian

USA . 4,557 parts In-Stock

1+ parts

-

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4,557

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Bristol Electronics

USA . 1,275 parts In-Stock

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-

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1,275

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,110 parts In-Stock

1+ parts

$0.296

100+ parts

-

1k+ parts

-

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2,110

$0.296

-

-

-

Corphita

USA . 522 parts In-Stock

1+ parts

$0.313

100+ parts

-

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522

$0.313

-

-

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$0.348

100+ parts

-

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432

$0.348

-

-

-

Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

$0.383

100+ parts

$0.364

1k+ parts

$0.346

10k+ parts

$0.341

500

$0.383

$0.364

$0.346

$0.341

Continental Prestige Electronics

USA . 6,029 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

-

10k+ parts

$0.376

6,029

$0.383

-

-

$0.376

Argo Parts USA

USA . 4,691 parts In-Stock

1+ parts

$0.383

100+ parts

-

1k+ parts

-

10k+ parts

$0.372

4,691

$0.383

-

-

$0.372

Perfect Parts

USA . 16,679 parts In-Stock

1+ parts

-

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16,679

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TANS Electronics

Latvia . 5,733 parts In-Stock

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5,733

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Kulean Microsystems

USA . 4,801 parts In-Stock

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4,801

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SupplyDigital Components

Austria . 3,182 parts In-Stock

1+ parts

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3,182

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Problanco Electronics

Mexico . 2,406 parts In-Stock

1+ parts

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2,406

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UHIMA Technologies

Türkiye . 852 parts In-Stock

1+ parts

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852

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Microchip USA

USA . 196 parts In-Stock

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196

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Overview

Unlock endless possibilities with the MC74LVXT4066DR2G by Onsemi. Crafted with precision and expertise, this multiplexer and switch offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides seamless performance and versatility. Experience the value of smooth operation, enhanced functionality, and innovative solutions with this cutting-edge technology. Trust Onsemi to deliver superior products that exceed expectations and elevate your projects to new heights. Choose the MC74LVXT4066DR2G for unmatched performance and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer/switch.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having 4 functions in one device increases efficiency and saves on board space compared to using multiple individual components.

Nominal Supply Voltage (Vsup): 3 V

The nominal supply voltage of 3 V indicates compatibility with common power supply configurations, making integration easier.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in a variety of environments and applications.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, making this multiplexer/switch energy-efficient and responsive.

Nominal Off-state Isolation: 37 dB

The high off-state isolation ensures that signal interference or crosstalk is minimized, improving overall performance and signal integrity.

Technical Specifications

Multiplexers & Switches MC74LVXT4066DR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

CONFIGURABLE AS 4-CHANNEL SINGLE ENDED MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

35 ns

Maximum Switch-on Time:

25 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC74LVXT4066DR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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