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MC74LVX4066MG

Onsemi

MC74LVX4066MG by Onsemi

MC74LVX4066MG by Onsemi is a CMOS SPST multiplexer with 4 functions, 14 terminals, and 3V nominal voltage. It has separate outputs, 50 ohm max on-state resistance, and operates in -55 to 125 °C range. Ideal for military-grade applications requiring fast switching times and high isolation levels.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,490 parts In-Stock

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Digiode

USA . 849 parts In-Stock

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AZTECH Wire

Italy . 928 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,666 parts In-Stock

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Problanco Electronics

Mexico . 8,288 parts In-Stock

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Corphita

USA . 1,826 parts In-Stock

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TANS Electronics

Latvia . 1,676 parts In-Stock

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Kulean Microsystems

USA . 1,004 parts In-Stock

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SupplyDigital Components

Austria . 833 parts In-Stock

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UHIMA Technologies

Türkiye . 570 parts In-Stock

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Corohmni

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Microchip USA

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Overview

Unleash the power of seamless connectivity with the MC74LVX4066MG multiplexer by Onsemi. Crafted with precision and quality, this versatile switch offers unparalleled performance in a compact package. Perfect for a wide range of applications, this product delivers reliability and efficiency like no other. Say goodbye to connectivity issues and hello to smooth operations with the MC74LVX4066MG. Experience the difference with Onsemi's top-notch technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/switch, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving space and simplifying the assembly process.

No. of Functions: 4

Offers versatile signal routing capabilities with multiple functions in a single component.

Nominal Supply Voltage (Vsup): 3 V

Compatible with a common supply voltage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring stable performance in demanding environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall efficiency.

Nominal Off-state Isolation: 37 dB

Provides excellent isolation between channels, minimizing crosstalk and ensuring accurate signal routing.

Technical Specifications

Multiplexers & Switches MC74LVX4066MG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

CONFIGURABLE AS 4-CHANNEL SINGLE ENDED MUX/DEMUX

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

37 dB

Nominal On-state Resistance Match:

25 ohm

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

15 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC74LVX4066MG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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