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MC74LVX4053D

Onsemi

MC74LVX4053D by Onsemi

MC74LVX4053D by Onsemi is a 3-channel single-ended multiplexer with CMOS technology. It operates at temperatures from -55 to 125 °C and has a max on-state resistance of 26 ohm. Ideal for applications requiring small outline packages, it offers break-before-make switching and nominal off-state isolation of 70 dB.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,344 parts In-Stock

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Digiode

USA . 1,276 parts In-Stock

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AZTECH Wire

Italy . 532 parts In-Stock

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$16.590

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Component Stockers USA

USA . 211 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 6,591 parts In-Stock

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Problanco Electronics

Mexico . 5,746 parts In-Stock

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TANS Electronics

Latvia . 2,492 parts In-Stock

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Corphita

USA . 1,830 parts In-Stock

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Kulean Microsystems

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Microchip USA

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Corohmni

South Africa . 50 parts In-Stock

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UHIMA Technologies

Türkiye . 33 parts In-Stock

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Overview

Experience seamless and reliable performance with the MC74LVX4053D by Onsemi, a top-tier manufacturer known for cutting-edge technology. This innovative multiplexer offers unparalleled quality and precision, making it the ideal choice for a wide range of applications. Maximize efficiency and functionality with this versatile product, providing exceptional value and benefits to customers looking for high-performance solutions. Trust Onsemi's expertise and craftsmanship to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use.

No. of Functions: 3

Having 3 functions in one device provides versatility and flexibility in signal routing.

Nominal Supply Voltage (Vsup): 3 V

Operating at 3 V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for usage in various environments without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer efficient and reliable.

Technical Specifications

Multiplexers & Switches MC74LVX4053D attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Minimum Negative Supply Voltage (Vsup):

-6 V

Nominal Negative Supply Voltage (Vsup):

-3 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

10 ohm

Maximum On-state Resistance (Ron):

26 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-3.3/GND,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Signal Current:

.02 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

28 ns

Maximum Switch-on Time:

28 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

MC74LVX4053D Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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