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MC74HCT259ADTG

Onsemi

MC74HCT259ADTG by Onsemi

MC74HCT259ADTG by Onsemi is an 8-bit latch with 42ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 4.5-5.5V. Ideal for military-grade applications requiring low-level trigger type and true output polarity in a compact SMD package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,482 parts In-Stock

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Digiode

USA . 1,547 parts In-Stock

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AZTECH Wire

Italy . 688 parts In-Stock

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$11.100

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$32.164

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$29.269

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$26.374

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$32.164

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$26.374

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SupplyDigital Components

Austria . 8,058 parts In-Stock

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Kulean Microsystems

USA . 4,812 parts In-Stock

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TANS Electronics

Latvia . 3,035 parts In-Stock

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Problanco Electronics

Mexico . 2,071 parts In-Stock

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Corphita

USA . 586 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 260 parts In-Stock

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Corohmni

South Africa . 126 parts In-Stock

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Overview

Enhance your electronic projects with the MC74HCT259ADTG by Onsemi, a top-quality latches & flip-flops component that guarantees reliable performance. Onsemi is a trusted manufacturer known for their innovative solutions and cutting-edge technology. This versatile product is ideal for a wide range of applications, offering customers unparalleled value with its fast propagation delay, low trigger type, and true output polarity. Upgrade your designs today with the MC74HCT259ADTG and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the latch & flip-flop durable and resistant to impact or environmental factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enhancing overall design flexibility.

Propagation Delay (tpd): 42 ns

With a low propagation delay, this latch & flip-flop enables fast signal processing and improved performance in time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability even in harsh operating conditions or environments.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows for consistent operation in both extreme cold and hot temperatures.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the latch & flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC74HCT259ADTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

42 ns

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

MC74HCT259ADTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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