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MC74HC4066ANG

Onsemi

MC74HC4066ANG by Onsemi

MC74HC4066ANG by Onsemi is a CMOS SPST switch with 4 functions, 120 ohm Ron, and 45 ns switch-on time. It operates at -55 to 125 °C and has a MILITARY grade. Ideal for applications requiring separate output switching in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,129 parts In-Stock

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Digiode

USA . 2,071 parts In-Stock

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EPE Components Inc.

USA . 30 parts In-Stock

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Bristol Electronics

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AZTECH Wire

Italy . 450 parts In-Stock

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$13.220

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TANS Electronics

Latvia . 3,246 parts In-Stock

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Kulean Microsystems

USA . 3,034 parts In-Stock

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Problanco Electronics

Mexico . 1,831 parts In-Stock

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SupplyDigital Components

Austria . 1,029 parts In-Stock

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UHIMA Technologies

Türkiye . 616 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Microchip USA

USA . 155 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the MC74HC4066ANG by Onsemi, a top-notch multiplexer and switch that offers unparalleled quality and reliability. With Onsemi's stellar reputation for producing cutting-edge components, you can trust the performance of this versatile product in various applications. From seamless signal routing to efficient circuit switching, this device delivers exceptional value and benefits to customers looking for superior functionality and precision. Elevate your projects with the MC74HC4066ANG and experience the advantages of using high-quality components from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring long-term reliability.

No. of Functions: 4

Having 4 functions allows for versatile signal routing capabilities, making the multiplexer suitable for a variety of applications.

Nominal Supply Voltage (Vsup): 3V

The nominal supply voltage of 3V is a common and widely used voltage level, making it compatible with many systems and power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in elevated temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the multiplexer energy-efficient and reliable in noisy environments.

Technical Specifications

Multiplexers & Switches MC74HC4066ANG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

14

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

20 ohm

Maximum On-state Resistance (Ron):

120 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/12

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Maximum Switch-off Time:

60 ns

Maximum Switch-on Time:

45 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC74HC4066ANG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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