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MC74HC4053AFG

Onsemi

MC74HC4053AFG by Onsemi

MC74HC4053AFG by Onsemi is a CMOS multiplexer with 3 functions, 2 channels, and 16 terminals. It operates b/w -55 to 125 °C and has a max on-state resistance of 80 ohm. Ideal for military-grade applications requiring small outline packages and low power consumption.

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Vyrian

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AZTECH Wire

Italy . 975 parts In-Stock

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Component Stockers USA

USA . 319 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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TANS Electronics

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Kulean Microsystems

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Problanco Electronics

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SupplyDigital Components

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Perfect Parts

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Corohmni

South Africa . 460 parts In-Stock

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Corphita

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UHIMA Technologies

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Overview

Enhance your electronic designs with the MC74HC4053AFG by Onsemi, a high-quality multiplexer and switch that delivers superior performance and reliability. Designed by the trusted manufacturer Onsemi, this versatile component offers 3 functions in a compact rectangular package, making it ideal for a wide range of applications. Whether you're working on military-grade projects or consumer electronics, this IC type single-ended multiplexer ensures efficient signal routing with minimal resistance. Trust Onsemi to provide cutting-edge technology and innovative solutions for your engineering needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface-mount option allows for easy and efficient PCB assembly, saving space and reducing production costs.

No. of Functions: 3

Having 3 functions in one device increases the functionality and versatility of the product, offering more flexibility in circuit design.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V ensures compatibility with a wide range of electronic systems, making it suitable for various applications.

Power Supplies (V): 2/6, GND/-6

The dual power supplies and negative supply voltage range of -6V make the product compatible with a variety of voltage requirements, enhancing its versatility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures that the product can operate reliably in harsh environments or under heavy loads.

Technology: CMOS

The CMOS technology used in the product provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a preferred choice for many applications.

Terminal Form: GULL WING

The Gull Wing terminal form allows for easy and reliable soldering during assembly, ensuring a secure connection and improving overall product performance.

Technical Specifications

Multiplexers & Switches MC74HC4053AFG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Nominal Off-state Isolation:

50 dB

Nominal On-state Resistance Match:

12 ohm

Maximum On-state Resistance (Ron):

80 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

160 ns

Maximum Switch-on Time:

245 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

5.275 mm

Trade Compliance

MC74HC4053AFG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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