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MC74HC4051ANG

Onsemi

MC74HC4051ANG by Onsemi

MC74HC4051ANG by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at temperatures from -55 to 125 °C and has a max supply voltage of 6V. With a nominal off-state isolation of 40 dB, it is ideal for military-grade applications requiring precise signal switching in compact spaces.

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1k+

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Digiode

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AZTECH Wire

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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Component Stockers USA

USA . 342 parts In-Stock

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Problanco Electronics

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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TANS Electronics

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SupplyDigital Components

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Corphita

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UHIMA Technologies

Türkiye . 559 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the MC74HC4051ANG by Onsemi. This multiplexer and switch offers unparalleled quality and reliability, backed by Onsemi's reputation for excellence. Perfect for a wide range of applications, this versatile component provides seamless switching between multiple channels with minimal on-state resistance. Experience the value and benefits of this product as it enhances your projects with its precise performance and efficiency. Upgrade to Onsemi and elevate your electronic designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the multiplexer, ensuring long-term reliability.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5 V makes it compatible with a wide range of power sources, increasing versatility.

No. of Channels: 8

With 8 channels, this multiplexer allows for the simultaneous switching of multiple signals, increasing functionality and flexibility in applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this multiplexer can withstand high temperatures, making it suitable for a variety of environments.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature ensures that there is no overlap or short-circuiting of signals during switching, enhancing the reliability and safety of the multiplexer.

Technical Specifications

Multiplexers & Switches MC74HC4051ANG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 12V (VCC-VEE) SUPPLY

Other IC type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

18 ohm

Maximum On-state Resistance (Ron):

170 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Maximum Switch-off Time:

76 ns

Maximum Switch-on Time:

83 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7.62 mm

Trade Compliance

MC74HC4051ANG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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