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MC74HC4051AFELG

Onsemi

MC74HC4051AFELG by Onsemi

MC74HC4051AFELG by Onsemi is a CMOS single-ended multiplexer with 8 channels. It operates at -55 to 125 °C, with a max supply voltage of 6 V and on-state resistance of 170 ohm. Ideal for military-grade applications requiring fast switching times and low power consumption.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 14,715 parts In-Stock

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-

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$0.383

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$0.318

10k+ parts

$0.283

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$0.383

$0.318

$0.283

Verical

USA . 14,715 parts In-Stock

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$0.398

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$0.354

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$0.398

$0.354

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Digiode

USA . 129 parts In-Stock

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$0.298

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Vyrian

USA . 3,924 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,998 parts In-Stock

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Corphita

USA . 608 parts In-Stock

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$0.283

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Corohmni

South Africa . 84 parts In-Stock

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$0.314

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AZTECH Wire

Italy . 536 parts In-Stock

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$11.490

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Continental Prestige Electronics

USA . 14,715 parts In-Stock

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$0.275

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Kulean Microsystems

USA . 6,339 parts In-Stock

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SupplyDigital Components

Austria . 5,471 parts In-Stock

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TANS Electronics

Latvia . 5,174 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,955 parts In-Stock

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RC Electronics

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Problanco Electronics

Mexico . 2,182 parts In-Stock

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Perfect Parts

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Assy Fe

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UHIMA Technologies

Türkiye . 538 parts In-Stock

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Microchip USA

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Overview

Unlock a world of possibilities with the MC74HC4051AFELG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. The MC74HC4051AFELG falls under the category of Multiplexers & Switches, offering versatility and efficiency in various applications. With its superior performance and innovative design, this product ensures seamless operation and precise signal routing. Experience the value and benefits of choosing Onsemi for your electronic component needs. Elevate your projects with the MC74HC4051AFELG today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Channels: 8

With 8 channels, this multiplexer offers versatility and flexibility in routing signals, making it suitable for various applications that require switching between multiple inputs.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, making the product efficient and reliable in operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes the product suitable for use in demanding environments where temperature fluctuations are common.

Technical Specifications

Multiplexers & Switches MC74HC4051AFELG attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 12V (VCC-VEE) SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

3

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

18 ohm

Maximum On-state Resistance (Ron):

170 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

76 ns

Maximum Switch-on Time:

83 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.275 mm

Trade Compliance

MC74HC4051AFELG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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