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MC74HC4051ADTR2

Onsemi

MC74HC4051ADTR2 by Onsemi

MC74HC4051ADTR2 by Onsemi is a CMOS multiplexer with 8 channels, 170 ohm Ron, and 83 ns switch-on time. Ideal for military-grade applications due to its -55 to 125 °C operating temperature range and compact design with small outline package. It features break-before-make switching and offers 40 dB off-state isolation.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 80 parts In-Stock

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$1.150

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$0.870

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$0.750

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80

$1.150

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$0.750

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Vyrian

USA . 4,528 parts In-Stock

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Digiode

USA . 1,009 parts In-Stock

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1,009

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Halfin

Belgium . 153 parts In-Stock

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153

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Distributors (Availability)

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Corohmni

South Africa . 244 parts In-Stock

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$1.150

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244

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AZTECH Wire

Italy . 100 parts In-Stock

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$17.490

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100

$17.490

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Component Stockers USA

USA . 265 parts In-Stock

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$99.990

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265

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RC Electronics

USA . 65,000 parts In-Stock

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$0.400

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$0.380

10k+ parts

$0.370

65,000

-

$0.400

$0.380

$0.370

A-Z Elektronik GmbH

Germany . 7,124 parts In-Stock

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SupplyDigital Components

Austria . 6,752 parts In-Stock

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TANS Electronics

Latvia . 5,648 parts In-Stock

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Corphita

USA . 2,352 parts In-Stock

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Problanco Electronics

Mexico . 1,420 parts In-Stock

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UHIMA Technologies

Türkiye . 803 parts In-Stock

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Kulean Microsystems

USA . 795 parts In-Stock

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Kepictronics

USA . 279 parts In-Stock

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Microchip USA

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Overview

Experience seamless signal routing with the MC74HC4051ADTR2 by Onsemi, a top-tier manufacturer known for superior quality and reliability. As a versatile multiplexer in the category of multiplexers & switches, this product offers customers unmatched value and benefits. Perfect for applications requiring precise signal switching, this single-ended multiplexer ensures efficient performance and optimal signal integrity. Upgrade your electronic systems with the MC74HC4051ADTR2 and enjoy seamless operation and enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the multiplexer, ensuring reliable performance over time.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5 V is a common voltage level that allows for compatibility with a wide range of electronic systems.

No. of Channels: 8

With 8 channels, this multiplexer offers versatile input/output options for connecting multiple sources to a single output, making it suitable for applications requiring signal routing and selection.

Technology: CMOS

The CMOS technology used in this multiplexer offers low power consumption, fast switching speeds, and high noise immunity, making it ideal for battery-powered and high-performance electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this multiplexer can withstand elevated temperatures without compromising its functionality, suitable for industrial and automotive applications.

Technical Specifications

Multiplexers & Switches MC74HC4051ADTR2 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH 2V TO 12V (VCC-VEE) SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Maximum Negative Supply Voltage (Vsup):

-6 V

Minimum Negative Supply Voltage (Vsup):

0 V

Nominal Negative Supply Voltage (Vsup):

-4.5 V

No. of Channels:

8

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

40 dB

Nominal On-state Resistance Match:

18 ohm

Maximum On-state Resistance (Ron):

170 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6,GND/-6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.08 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

76 ns

Maximum Switch-on Time:

83 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4.4 mm

Trade Compliance

MC74HC4051ADTR2 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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