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MC34262PG

Onsemi

MC34262PG by Onsemi

MC34262PG by Onsemi is a switching regulator with 12V nominal voltage, 0.5A max output current, and boost switcher config. It operates in a temperature range of 0-85 °C and is ideal for power factor control applications.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Vyrian

USA . 5,629 parts In-Stock

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Infinite Electronics LLP

India . 2,399 parts In-Stock

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Digiode

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R&J Components

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

France . 47 parts In-Stock

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Corohmni

South Africa . 426 parts In-Stock

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$0.439

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AZTECH Wire

Italy . 960 parts In-Stock

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Problanco Electronics

Mexico . 8,023 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,235 parts In-Stock

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Perfect Parts

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Microchip USA

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 2,620 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 1,318 parts In-Stock

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Assy Fe

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UHIMA Technologies

Türkiye . 981 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 101 parts In-Stock

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Overview

Experience the superior quality and reliability of the MC34262PG from Onsemi, a leading manufacturer in the industry. This switching regulator/controller offers unparalleled efficiency and performance for a wide range of applications. With a robust design and innovative technology, this product delivers exceptional value and benefits to customers looking for precise power management solutions. Trust Onsemi's expertise and choose the MC34262PG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V ensures compatibility with a wide range of applications.

Power Supplies (V): 12

Provides a stable power supply of 12V, suitable for various electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in harsh environments.

Control Mode: CURRENT-MODE

Current-mode control offers improved transient response and stability, enhancing overall performance.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

Technology: BIPOLAR

Bipolar technology offers efficient power conversion and high reliability, making the product a durable choice.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for precise regulation of output voltage, improving efficiency.

Technical Specifications

Switching Regulators & Controllers MC34262PG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.5 A

Nominal Output Voltage:

16 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

20 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Switcher Config:

BOOST

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC34262PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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