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MC33762DM-2525R2G

Onsemi

MC33762DM-2525R2G by Onsemi

MC33762DM-2525R2G by Onsemi is a BIPOLAR LDO Regulator with 2 outputs. It has a Max Dropout Voltage of 0.25 V, operating temperature up to 125 °C, and package style SMALL OUTLINE. Ideal for applications requiring fixed positive multiple output voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,227 parts In-Stock

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Digiode

USA . 1,138 parts In-Stock

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SupplyDigital Components

Austria . 8,367 parts In-Stock

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Kulean Microsystems

USA . 7,991 parts In-Stock

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Problanco Electronics

Mexico . 5,439 parts In-Stock

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Corphita

USA . 1,585 parts In-Stock

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UHIMA Technologies

Türkiye . 931 parts In-Stock

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Corohmni

South Africa . 479 parts In-Stock

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TANS Electronics

Latvia . 246 parts In-Stock

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Overview

Discover the cutting-edge technology of the MC33762DM-2525R2G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As a Fixed Regulator - Positive Multiple Output LDO, this product offers unparalleled performance and efficiency in a compact package. Ideal for a range of applications, this regulator provides stable output voltages with minimal dropout, ensuring optimal functionality for your devices. Experience the value and benefits of choosing Onsemi for all your power regulation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the product is lightweight and can withstand a variety of environmental conditions, making it ideal for a wide range of applications.

Maximum Dropout Voltage-1: 2.25 V

The low dropout voltage ensures efficient power conversion and minimal power loss, making the product energy-efficient.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration onto circuit boards, saving space and simplifying the assembly process.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature range, the product can function effectively in various environments without the risk of overheating.

Nominal Output Voltage-2: 2.5 V

The stable output voltage ensures consistent performance and reliable power supply, making it suitable for sensitive electronic devices.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in voltage regulation, making the product suitable for applications where precise power delivery is crucial.

Maximum Voltage Tolerance: 3 %

The tight voltage tolerance ensures that the output voltage remains within a specified range, providing stable power for connected devices.

Maximum Line Regulation: 0.02 %

With minimal line regulation, the product maintains a constant output voltage even with fluctuations in input voltage, ensuring stable performance.

Maximum Output Current-1: 0.08 A

The high output current capability allows the product to power multiple devices simultaneously, making it versatile for use in complex electronic systems.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO MC33762DM-2525R2G attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.25 V

Nominal Dropout Voltage-1:

.16 V

Maximum Dropout Voltage-2:

.25 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

12 V

Minimum Input Voltage:

3.5 V

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Maximum Line Regulation:

.02 %

Maximum Load Regulation:

.04 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.08 A

Maximum Output Voltage-1:

2.575 V

Minimum Output Voltage-1:

2.425 V

Nominal Output Voltage-1:

2.5 V

Maximum Output Voltage-2:

2.575 V

Minimum Output Voltage-2:

2.425 V

Nominal Output Voltage-2:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

MC33762DM-2525R2G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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