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CS8361YDWF16G

Onsemi

CS8361YDWF16G by Onsemi

CS8361YDWF16G by Onsemi is a Fixed Positive Multiple Output LDO Regulator with 2 outputs. It offers a Max Dropout Voltage of 0.7V and 0.6V, suitable for applications requiring stable voltage regulation in a compact form factor. With an operating temperature range from -40 °C to 150°C, it is ideal for various electronic devices needing reliable power management solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,853 parts In-Stock

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Native Components

USA . 960 parts In-Stock

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$1.149

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Northwest PG Solutions

USA . 1,364 parts In-Stock

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Component Stockers USA

USA . 457 parts In-Stock

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TANS Electronics

Latvia . 7,607 parts In-Stock

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Problanco Electronics

Mexico . 5,605 parts In-Stock

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SupplyDigital Components

Austria . 4,796 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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Corohmni

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Microchip USA

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Corphita

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Overview

Discover the Onsemi CS8361YDWF16G, a high-quality Fixed Positive Multiple Output LDO Regulator that delivers reliable performance and efficiency. Manufactured by Onsemi, a trusted name in the industry, this regulator is designed for various applications, ensuring stable power supply for your devices. With its compact size and advanced technology, the CS8361YDWF16G offers unmatched value, benefits, and advantages to customers looking for a dependable solution. Upgrade your projects with this exceptional product and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Maximum Dropout Voltage-2: 2.7 V

This low dropout voltage ensures efficient regulation of the output voltage, minimizing power loss and maximizing energy efficiency.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Operating Temperature (TJ-Max): 150 °C

With a high operating temperature range, this regulator can withstand harsh environmental conditions and operate reliably in extreme temperatures.

Nominal Output Voltage-2: 5 V

The stable 5V output voltage ensures consistent performance and reliable operation of connected devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO CS8361YDWF16G attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Onsemi

Specs

Adjustability:

FIXED/ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.4 V

Maximum Dropout Voltage-2:

.7 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

26 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Maximum Line Regulation:

.05 %

Maximum Load Regulation:

.05 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

16

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current-1:

.1 A

Maximum Output Current-2:

.25 A

Maximum Output Voltage-1:

5.1 V

Minimum Output Voltage-1:

4.9 V

Nominal Output Voltage-1:

5 V

Maximum Output Voltage-2:

20 V

Minimum Output Voltage-2:

5 V

Nominal Output Voltage-2:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Voltage Tolerance:

2 %

Width:

7.5 mm

Trade Compliance

CS8361YDWF16G Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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