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MC33364DR2G

Onsemi

MC33364DR2G by Onsemi

MC33364DR2G by Onsemi is a switching controller with max output current of 0.005A and max input voltage of 20V. It operates in current-mode control technique at a max switching frequency of 800kHz. This small outline package is ideal for applications requiring efficient power regulation in compact spaces.

Median Price

$1.014

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,275 parts In-Stock

1+ parts

-

100+ parts

$0.995

1k+ parts

$0.826

10k+ parts

$0.736

20,275

-

$0.995

$0.826

$0.736

Verical

USA . 20,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.032

10k+ parts

$0.920

20,275

-

-

$1.032

$0.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$1.551

100+ parts

-

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72

$1.551

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Chip Stock

USA . 68,252 parts In-Stock

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68,252

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Vyrian

USA . 7,607 parts In-Stock

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7,607

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 117 parts In-Stock

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117

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Distributors (Availability)

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Semicontronic

India . 24,630 parts In-Stock

1+ parts

$0.730

100+ parts

$0.712

1k+ parts

$0.708

10k+ parts

-

24,630

$0.730

$0.712

$0.708

-

Corohmni

South Africa . 222 parts In-Stock

1+ parts

$1.519

100+ parts

-

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-

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222

$1.519

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Argo Parts USA

USA . 3,990 parts In-Stock

1+ parts

$1.551

100+ parts

-

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3,990

$1.551

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Continental Prestige Electronics

USA . 786 parts In-Stock

1+ parts

$1.551

100+ parts

-

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-

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$1.519

786

$1.551

-

-

$1.519

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.551

100+ parts

-

1k+ parts

$1.473

10k+ parts

$1.442

100

$1.551

-

$1.473

$1.442

Ampacity Inc.

Singapore . 24,904 parts In-Stock

1+ parts

$1.580

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-

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24,904

$1.580

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Microchip USA

USA . 139 parts In-Stock

1+ parts

$5.142

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139

$5.142

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Aztec Data Supply Inc.

USA . 125 parts In-Stock

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$6.870

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$6.870

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AZTECH Wire

Italy . 840 parts In-Stock

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$8.790

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840

$8.790

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SupplyDigital Components

Austria . 7,734 parts In-Stock

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7,734

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TANS Electronics

Latvia . 6,704 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,943 parts In-Stock

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Lixinc

USA . 5,113 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Problanco Electronics

Mexico . 4,796 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kulean Microsystems

USA . 2,705 parts In-Stock

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UHIMA Technologies

Türkiye . 515 parts In-Stock

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515

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Corphita

USA . 181 parts In-Stock

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Advanced Electronics

New Zealand . 23 parts In-Stock

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Overview

Unlock the power of efficient energy management with the MC33364DR2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The MC33364DR2G falls under the category of Switching Regulators & Controllers, offering versatile applications in various systems. With its current-mode control mode and pulse width modulation technique, this switching controller provides optimal performance for your power management needs. Experience the value and benefits of this product, from its compact design to its high efficiency output, making it an ideal choice for customers seeking reliable and effective solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for compact designs.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into circuit layouts and facilitates overall space efficiency.

No. of Terminals: 14

Having multiple terminals provides flexibility in connecting the regulator to other components in the circuit.

Control Mode: CURRENT-MODE

Current-mode control offers improved performance, stability, and protection against overloads.

Minimum Operating Temperature: -25 °C

The wide temperature range allows the product to function reliably in different environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish enhances solderability and ensures a reliable connection during assembly.

Maximum Switching Frequency: 800 kHz

High switching frequency enables efficient power conversion and helps in reducing the overall size of the circuit components.

Maximum Output Current: 0.005 A

Despite the low output current, this product may be suitable for low-power applications where precision is crucial.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers excellent regulation and efficiency in power conversion, making the product ideal for various applications.

Technical Specifications

Switching Regulators & Controllers MC33364DR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

20 V

Minimum Input Voltage:

10 V

Nominal Input Voltage:

15.5 V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14/16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

800 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

MC33364DR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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