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MC33362DWG

Onsemi

MC33362DWG by Onsemi

MC33362DWG by Onsemi is a 13-terminal switching regulator with VOLTAGE-MODE control, 2A output current, and 315 kHz max switching frequency. Ideal for applications requiring efficient power conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 27,500 parts In-Stock

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Vyrian

USA . 4,033 parts In-Stock

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Digiode

USA . 1,474 parts In-Stock

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1,474

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AZTECH Wire

Italy . 1,191 parts In-Stock

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$14.040

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SupplyDigital Components

Austria . 7,277 parts In-Stock

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Problanco Electronics

Mexico . 6,872 parts In-Stock

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TANS Electronics

Latvia . 3,339 parts In-Stock

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UHIMA Technologies

Türkiye . 433 parts In-Stock

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433

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Kulean Microsystems

USA . 412 parts In-Stock

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Corohmni

South Africa . 132 parts In-Stock

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Microchip USA

USA . 129 parts In-Stock

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Corphita

USA . 86 parts In-Stock

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Overview

Upgrade your electronics with the MC33362DWG by Onsemi, a top-quality switching regulator that guarantees superior performance and reliability. With its advanced technology and durable design, this product from a trusted manufacturer ensures efficient power management in various applications. Experience the value of seamless voltage control, high output current capability, and compact size that this regulator offers, making it the perfect choice for your projects. Trust Onsemi to deliver top-notch products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding too much weight.

Surface Mount: YES

The surface mount feature makes it easy to integrate the product onto circuit boards, saving space and making assembly more efficient.

No. of Terminals: 13

Having 13 terminals allows for more connectivity options, enabling the product to be versatile in different circuit designs.

Maximum Output Current: 2 A

With a maximum output current of 2A, this product can power up to 2 amperes worth of devices, making it suitable for a wide range of applications.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique provides precise control over the output voltage, making the product efficient and stable in regulating power.

Technical Specifications

Switching Regulators & Controllers MC33362DWG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

40 V

Minimum Input Voltage:

20 V

Nominal Input Voltage:

20 V

JESD-30 Code:

R-PDSO-G13

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

13

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

315 kHz

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

MC33362DWG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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