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MC33269T

Onsemi

MC33269T by Onsemi

MC33269T by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.8A and dropout voltage of 1.25V. It operates in temperatures ranging from -40 to 150 °C, making it suitable for various applications requiring stable voltage regulation in tight spaces.

Median Price

$2.056

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 97 parts In-Stock

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$0.263

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Component Electronics Inc.

Canada . 41 parts In-Stock

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$3.850

100+ parts

$2.880

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$2.500

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41

$3.850

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$2.500

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Chip Stock

USA . 3,150 parts In-Stock

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Q Components

USA . 2,376 parts In-Stock

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Vyrian

USA . 2,341 parts In-Stock

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Manotoh

Italy . 500 parts In-Stock

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R&J Components

USA . 437 parts In-Stock

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Lakeland Logistics Inc

USA . 367 parts In-Stock

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Bristol Electronics

USA . 367 parts In-Stock

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Digiode

USA . 327 parts In-Stock

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First Choice Components Inc.

USA . 150 parts In-Stock

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PC Components Company LLC

USA . 8 parts In-Stock

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MISTER SPROCKETS

USA . 6 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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$0.263

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TANS Electronics

Latvia . 6,483 parts In-Stock

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Kulean Microsystems

USA . 4,557 parts In-Stock

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Problanco Electronics

Mexico . 3,907 parts In-Stock

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Microchip USA

USA . 398 parts In-Stock

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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SupplyDigital Components

Austria . 185 parts In-Stock

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Corphita

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Overview

Enhance your electronic devices with the MC33269T from Onsemi, a top-tier manufacturer known for delivering high-quality adjustable regulators. This LDO regulator offers customers reliable performance and precise voltage control, making it perfect for a wide range of applications. With a maximum output current of 0.8 A and minimal load regulation, this product ensures stable and efficient power management. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations and enhances the functionality of your projects.

Feature Benefit Bullets

Maximum Dropout Voltage

Low dropout voltage ensures stable output voltage even when input voltage is close to the output voltage.

Operating Temperature (TJ-Max)

Wide operating temperature range allows for reliable performance in various environmental conditions.

Maximum Input-Output Voltage Differential

High voltage differential capability provides flexibility in input voltage selection.

Technology

Bipolar technology ensures high precision and low noise operation.

Package Shape

Rectangular package shape allows for easy integration into different electronic circuits.

Terminal Form

Through-hole terminal form provides strong mechanical connection for secure mounting.

Operating Temperature (TJ-Min)

Wide temperature range allows for reliable operation even in extreme cold conditions.

Packing Method

Rail packing method facilitates easy handling and transportation of multiple units.

Minimum Output Voltage

Low minimum output voltage allows for precise voltage regulation at low levels.

No. of Terminals

3 terminals offer simple and straightforward connection to external circuitry.

Maximum Line Regulation

Low line regulation percentage ensures stable output voltage despite changes in input voltage.

Package Style

Flange mount package style provides secure and stable mounting options.

Adjustability

Adjustable output voltage allows for customization to specific application requirements.

Maximum Load Regulation

Low load regulation percentage ensures stable output voltage even with varying load conditions.

Terminal Pitch

Standard terminal pitch allows for easy integration into standard PCB layouts.

Minimum Input-Output Voltage Differential

Low minimum differential voltage allows for operation even with small voltage differences.

Regulator Type

Adjustable positive single output LDO regulator provides precise voltage regulation for various applications.

Terminal Finish

Tin lead terminal finish ensures reliable electrical connections and soldering.

Terminal Position

Single terminal position simplifies connection and mounting processes.

Maximum Output Voltage

High maximum output voltage provides flexibility for different voltage requirements.

Maximum Output Current

High maximum output current capability allows for powering of various loads.

Peak Reflow Temperature

High peak reflow temperature ensures reliable soldering during assembly processes.

Nominal Dropout Voltage

Low nominal dropout voltage ensures efficient power conversion with minimal energy loss.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO MC33269T attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

1.25 V

Nominal Dropout Voltage-1:

1.1 V

Maximum Input-Output Voltage Differential:

15 V

Minimum Input-Output Voltage Differential:

1.35 V

JESD-30 Code:

R-XSFM-T3

JESD-609 Code:

e0

Maximum Line Regulation (%/V):

.017

Maximum Load Regulation (%):

.5 %

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

1.275 V

Minimum Output Voltage-1:

1.225 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SIP3,.1TB

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Qualification Status:

Not Qualified

Sub-Category:

Other Regulators

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

MC33269T Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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