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MC33269DTG

Onsemi

MC33269DTG by Onsemi

MC33269DTG by Onsemi is an adjustable positive single output LDO regulator with a max output current of 0.8A and a dropout voltage of 1.25V. It operates in temperatures ranging from -40 to 150°C, making it suitable for various applications requiring stable voltage regulation in compact spaces.

Median Price

$0.620

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Nova Conductors

Japan . 600 parts In-Stock

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$0.620

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Vyrian

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Digiode

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Cogito LLC

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Amalfi Trading

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Speed Components Ltd

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Holdelec - ElecDif-Pro

France . 50 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 45 parts In-Stock

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Goldney Electronics S.L.

Spain . 30 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Prism Electronics

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Argo Parts USA

USA . 4,893 parts In-Stock

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$0.620

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$0.601

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Continental Prestige Electronics

USA . 2,954 parts In-Stock

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$0.620

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$0.608

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$0.632

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Aztec Data Supply Inc.

USA . 884 parts In-Stock

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Semicontronic

India . 341 parts In-Stock

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$8.500

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$8.288

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$8.245

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AZTECH Wire

Italy . 889 parts In-Stock

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Perfect Parts

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Kulean Microsystems

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Lixinc

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TANS Electronics

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Problanco Electronics

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SupplyDigital Components

Austria . 3,669 parts In-Stock

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Corphita

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Metaverse IC Inc.

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iodParts Technologies Inc.

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UHIMA Technologies

Türkiye . 560 parts In-Stock

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Corohmni

South Africa . 159 parts In-Stock

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Microchip USA

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Overview

Discover the MC33269DTG by Onsemi, a top-quality adjustable regulator that offers superior performance and reliability. Onsemi, a trusted manufacturer known for its cutting-edge technology, brings you this product that is perfect for various applications in the electronics industry. With its adjustable output and low dropout voltage, this LDO regulator ensures stable power supply, making it ideal for a wide range of devices. Experience the value and benefits of the MC33269DTG, where quality meets innovation to deliver exceptional results for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Maximum Dropout Voltage: 1.25 V

Low dropout voltage ensures efficient power conversion and minimal power loss, making it energy-efficient.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient integration onto circuit boards.

Operating Temperature (TJ-Max): 150 °C

High maximum operating temperature range ensures the product can function reliably in various environmental conditions.

Maximum Input-Output Voltage Differential: 15 V

Wide input-output voltage differential capability allows for versatility in power supply design.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO MC33269DTG attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

1.25 V

Nominal Dropout Voltage-1:

1.1 V

Maximum Input-Output Voltage Differential:

15 V

Minimum Input-Output Voltage Differential:

1.35 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.54 mm

Maximum Line Regulation (%/V):

.017

Maximum Load Regulation (%):

.5 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

150 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.8 A

Maximum Output Voltage-1:

1.275 V

Minimum Output Voltage-1:

1.225 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.29 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.095 mm

Trade Compliance

MC33269DTG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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