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MC33262DG

Onsemi

MC33262DG by Onsemi

MC33262DG by Onsemi is a switching regulator with 12V nominal voltage, 0.5A max output current, and boost switcher config. Ideal for power factor control applications in industrial settings due to its current-mode control technique and 1.27mm terminal pitch.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,327 parts In-Stock

1+ parts

$0.430

100+ parts

$0.420

1k+ parts

$0.410

10k+ parts

-

1,327

$0.430

$0.420

$0.410

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Distributors (In-Stock)

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.438

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-

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700

$0.438

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Vyrian

USA . 11,474 parts In-Stock

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11,474

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LIBRA Elektronik GmbH

Germany . 181 parts In-Stock

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181

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Digiode

USA . 156 parts In-Stock

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156

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Distributors (Availability)

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Corohmni

South Africa . 160 parts In-Stock

1+ parts

$0.429

100+ parts

-

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160

$0.429

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Netroflash

USA . 1,000 parts In-Stock

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$0.438

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1,000

$0.438

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Ampacity Inc.

Singapore . 1,476 parts In-Stock

1+ parts

$6.500

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1,476

$6.500

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AZTECH Wire

Italy . 378 parts In-Stock

1+ parts

$17.942

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378

$17.942

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SupplyDigital Components

Austria . 8,164 parts In-Stock

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8,164

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Perfect Parts

USA . 7,689 parts In-Stock

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7,689

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Problanco Electronics

Mexico . 3,578 parts In-Stock

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3,578

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TANS Electronics

Latvia . 2,820 parts In-Stock

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2,820

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Corphita

USA . 2,105 parts In-Stock

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2,105

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Kulean Microsystems

USA . 866 parts In-Stock

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866

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UHIMA Technologies

Türkiye . 325 parts In-Stock

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325

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Kepictronics

USA . 146 parts In-Stock

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146

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Microchip USA

USA . 106 parts In-Stock

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106

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Overview

Unleash the power of efficient energy management with the MC33262DG by Onsemi. Designed with precision and reliability in mind, this switching regulator offers unparalleled performance for a wide range of applications. From industrial settings to consumer electronics, this small outline package delivers optimal power supplies with current-mode control technique. With a maximum output current of 0.5A and a compact design, the MC33262DG ensures seamless operation in any environment. Upgrade your systems with this high-quality product and experience the benefits of superior power management today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers durability and protects the internal components of the product, making it reliable for long-term use.

Surface Mount: YES

Surface mount technology makes the product easy to install on a printed circuit board, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with a wide range of applications and power sources.

Control Mode: CURRENT-MODE

Current-mode control ensures stable and efficient operation, allowing for precise regulation of output current.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand high-temperature soldering processes, ensuring secure connections during assembly.

Maximum Output Current: 0.5 A

The maximum output current of 0.5A allows the product to deliver sufficient power for various applications without overloading the system.

Technology: BIPOLAR

Utilizing bipolar technology provides stable performance and efficient power conversion, making the product a reliable choice for voltage regulation.

Technical Specifications

Switching Regulators & Controllers MC33262DG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Nominal Output Voltage:

16 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Switching Regulator or Controllers

Maximum Supply Current (Isup):

20 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Switcher Config:

BOOST

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MC33262DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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