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MC33260PG

Onsemi

MC33260PG by Onsemi

MC33260PG by Onsemi is a VOLTAGE-MODE switcher with 0.5 A output current. It operates b/w -40 to 105 °C and supports PULSE WIDTH MODULATION control technique. Ideal for POWER FACTOR CONTROL applications due to its boost configuration and 13-16 V input voltage range.

Median Price

$1.320

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$1.320

1k+ parts

$1.100

10k+ parts

$0.977

1

-

$1.320

$1.100

$0.977

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,156 parts In-Stock

1+ parts

$1.026

100+ parts

-

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1,156

$1.026

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Vyrian

USA . 4,570 parts In-Stock

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4,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,654 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

-

10k+ parts

-

1,654

$0.972

-

-

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Corohmni

South Africa . 392 parts In-Stock

1+ parts

$1.080

100+ parts

-

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392

$1.080

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-

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AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$14.210

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208

$14.210

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Problanco Electronics

Mexico . 8,120 parts In-Stock

1+ parts

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8,120

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TANS Electronics

Latvia . 7,355 parts In-Stock

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7,355

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Kepictronics

USA . 4,794 parts In-Stock

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4,794

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SupplyDigital Components

Austria . 1,287 parts In-Stock

1+ parts

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1,287

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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600

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Kulean Microsystems

USA . 526 parts In-Stock

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526

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Microchip USA

USA . 190 parts In-Stock

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190

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Overview

Discover the power of the MC33260PG by Onsemi, a top-of-the-line switching regulator & controller designed to exceed your expectations. With a reputation for excellence in quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. From industrial to automotive, this versatile product offers unmatched value, efficiency, and performance. Say goodbye to technical headaches and hello to seamless operation with the MC33260PG - the ultimate choice for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and protection for the internal components.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105 °C, this product can withstand high temperature environments, making it suitable for industrial applications.

Control Mode: VOLTAGE-MODE

The voltage-mode control mode ensures stable and efficient voltage regulation, making this product reliable in maintaining consistent power output.

Maximum Output Current: 0.5 A

The maximum output current of 0.5 A allows for sufficient power delivery, making this product suitable for low-power applications.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique provides precise control over the power output, allowing for efficient energy conversion.

Technical Specifications

Switching Regulators & Controllers MC33260PG attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

8.5 V

Nominal Input Voltage:

13 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

MC33260PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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