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MC1403DG

Onsemi

MC1403DG by Onsemi

MC1403DG by Onsemi is a 3-terminal voltage reference with a nominal output voltage of 2.5V and max supply voltage of 40V. It operates b/w -40 to +70 °C, making it suitable for commercial applications requiring precise voltage regulation in compact designs. The package is small outline, surface mountable, with dual terminals and Gull Wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,631 parts In-Stock

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Digiode

USA . 1,281 parts In-Stock

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J2 Sourcing AB

Sweden . 11 parts In-Stock

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Ampacity Inc.

Singapore . 1,582 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 227 parts In-Stock

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Problanco Electronics

Mexico . 8,105 parts In-Stock

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TANS Electronics

Latvia . 7,894 parts In-Stock

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Metaverse IC Inc.

Canada . 6,533 parts In-Stock

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Kulean Microsystems

USA . 5,523 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,092 parts In-Stock

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Microchip USA

USA . 3,286 parts In-Stock

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Corphita

USA . 1,223 parts In-Stock

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SupplyDigital Components

Austria . 1,094 parts In-Stock

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Kepictronics

USA . 1,078 parts In-Stock

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UHIMA Technologies

Türkiye . 937 parts In-Stock

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Corohmni

South Africa . 496 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MC1403DG voltage reference by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. The MC1403DG offers precise output voltage stability, ensuring accurate and consistent performance. With a compact design and versatile features, this voltage reference is ideal for various electronic systems. Trust Onsemi to provide value and innovation, choose the MC1403DG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components, making the product durable and reliable.

Nominal Supply Voltage (Vsup) 15 V

Suitable for applications requiring a stable 15V reference voltage.

Minimum Output Voltage 2.475 V

Provides a precise reference voltage output for accurate measurements and calculations.

Maximum Operating Temperature 70 °C

Can operate reliably in high temperature environments, increasing the product's versatility.

Technology: BIPOLAR

Bipolar technology ensures good stability and accuracy in the reference voltage output.

Technical Specifications

Voltage References MC1403DG attributes and parameters. Explore more Voltage References devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Voltage:

2.525 V

Minimum Output Voltage:

2.475 V

Nominal Output Voltage:

2.5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

40 ppm/Cel

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

1 %

Width (mm):

3.9 mm

Trade Compliance

MC1403DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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