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MC10H016FNR2G

Onsemi

MC10H016FNR2G by Onsemi

MC10H016FNR2G by Onsemi is a 4-bit digital counter with 2.5 ns propagation delay and max freq of 200 MHz. It operates in commercial extended temp range, ideal for synchronous applications requiring fast counting capabilities in electronic circuits.

Median Price

$19.159

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,161 parts In-Stock

1+ parts

-

100+ parts

$17.030

1k+ parts

$15.240

10k+ parts

$14.340

2,161

-

$17.030

$15.240

$14.340

Verical

USA . 850 parts In-Stock

1+ parts

-

100+ parts

$21.288

1k+ parts

$19.050

10k+ parts

$17.925

850

-

$21.288

$19.050

$17.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,428 parts In-Stock

1+ parts

$18.022

100+ parts

-

1k+ parts

-

10k+ parts

-

2,428

$18.022

-

-

-

Vyrian

USA . 7,736 parts In-Stock

1+ parts

-

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-

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7,736

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,723 parts In-Stock

1+ parts

$17.073

100+ parts

-

1k+ parts

-

10k+ parts

-

1,723

$17.073

-

-

-

Corohmni

South Africa . 296 parts In-Stock

1+ parts

$18.612

100+ parts

-

1k+ parts

-

10k+ parts

-

296

$18.612

-

-

-

Component Stockers USA

USA . 2,225 parts In-Stock

1+ parts

$19.140

100+ parts

$17.990

1k+ parts

$16.270

10k+ parts

-

2,225

$19.140

$17.990

$16.270

-

AZTECH Wire

Italy . 187 parts In-Stock

1+ parts

$21.950

100+ parts

-

1k+ parts

-

10k+ parts

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187

$21.950

-

-

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TANS Electronics

Latvia . 6,801 parts In-Stock

1+ parts

-

100+ parts

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6,801

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SupplyDigital Components

Austria . 6,108 parts In-Stock

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6,108

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Problanco Electronics

Mexico . 2,576 parts In-Stock

1+ parts

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2,576

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Continental Prestige Electronics

USA . 2,161 parts In-Stock

1+ parts

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100+ parts

$13.720

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2,161

-

$13.720

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Kulean Microsystems

USA . 939 parts In-Stock

1+ parts

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939

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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513

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Microchip USA

USA . 387 parts In-Stock

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387

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Overview

Experience the power of advanced digital counting with the MC10H016FNR2G by Onsemi. With a reputation for superior quality and innovation, Onsemi delivers cutting-edge solutions for various applications in the digital counters category. This high-performance chip carrier boasts fast propagation delay, efficient operation at both high and low temperatures, and seamless synchronization. Elevate your projects with the reliability, precision, and flexibility that only Onsemi can provide. Unleash the full potential of your designs with the MC10H016FNR2G and discover a new level of performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FRAMs lightweight and durable, suitable for various applications.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures efficient and coordinated data transfer and processing within the FRAMs.

Nominal Supply Voltage (Vsup): 1.8V

The low nominal supply voltage of 1.8V enhances the energy efficiency of the FRAMs, contributing to lower power consumption.

Organization: 2MX8

The 2MX8 organization provides a large memory capacity and efficient data storage capabilities for the FRAMs.

Write Protection: HARDWARE/SOFTWARE

The combination of hardware and software write protection features ensures data security and integrity within the FRAMs.

Maximum Clock Frequency (fCLK): 20 MHz

The high maximum clock frequency of 20 MHz enables fast data transfer and processing speeds in the FRAMs.

Memory IC Type: FRAM

The use of FRAM (Ferroelectric Random Access Memory) technology offers high-speed read and write operations, low power consumption, and high endurance, making it a reliable choice for memory storage.

Technical Specifications

Digital Counters MC10H016FNR2G attributes and parameters. Explore more Digital Counters devices from Onsemi

Specs

Count Direction:

UP

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Load or Preset Input:

YES

Logic IC Type:

Maximum Frequency At Nominal Supply:

200000000 Hz

Operation Mode:

SYNCHRONOUS

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

126 mA

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Counters

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

8.965 mm

Minimum fmax:

200 MHz

Trade Compliance

MC10H016FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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