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MC100EP016AMNR2G

Onsemi

MC100EP016AMNR2G by Onsemi

MC100EP016AMNR2G by Onsemi is an 8-bit digital counter with a propagation delay of 0.7 ns, operating at a max frequency of 1.1 GHz. It features synchronous operation and positive edge trigger type, suitable for high-speed applications requiring precise counting and timing accuracy. This chip carrier package with a very thin profile is ideal for surface mount designs in electronic systems where space-saving and fast signal processing are crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,349 parts In-Stock

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1,349

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Digiode

USA . 910 parts In-Stock

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910

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Kulean Microsystems

USA . 7,319 parts In-Stock

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7,319

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Problanco Electronics

Mexico . 7,161 parts In-Stock

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SupplyDigital Components

Austria . 6,420 parts In-Stock

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TANS Electronics

Latvia . 5,145 parts In-Stock

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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979

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Corphita

USA . 938 parts In-Stock

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938

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Corohmni

South Africa . 236 parts In-Stock

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Overview

Enhance your digital counter applications with the MC100EP016AMNR2G by Onsemi. With a superior quality build and innovative technology, this product offers reliable performance and precision. From its surface mount capability to its low propagation delay of 0.7 ns, this digital counter is designed to meet your high-speed counting needs. Whether you're in telecommunications, data communications, or industrial automation, this product provides value, efficiency, and accuracy that will elevate your projects to the next level. Trust Onsemi for all your digital counter requirements.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and secure mounting of the digital counter onto a printed circuit board, making integration into electronic devices more efficient.

Package Shape: SQUARE

The square package shape offers a compact design, saving space on the PCB and allowing for more efficient use of board real estate.

No. of Bits: 8

With 8 bits, this digital counter can handle a wide range of counting tasks and calculations, providing versatility in various electronic applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with many common electronic systems and devices, making integration easier and more seamless.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this digital counter is reliable and suitable for use in a range of environmental conditions.

Maximum Frequency At Nominal Supply: 1100000000 Hz

The high maximum frequency at the nominal supply voltage of 1.1 GHz makes this digital counter ideal for high-speed counting applications, providing accurate and efficient results.

Technology: ECL

Employing Emitter-Coupled Logic technology, this digital counter offers fast operation and low power consumption, making it a reliable choice for demanding electronic systems.

Technical Specifications

Digital Counters MC100EP016AMNR2G attributes and parameters. Explore more Digital Counters devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -3.6V

Count Direction:

UP

Family:

100E

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Load or Preset Input:

YES

Logic IC Type:

Maximum Frequency At Nominal Supply:

1100000000 Hz

Operation Mode:

SYNCHRONOUS

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

210 mA

Propagation Delay (tpd):

.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

5 mm

Minimum fmax:

1200 MHz

Trade Compliance

MC100EP016AMNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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