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MC10EP33DR2

Onsemi

MC10EP33DR2 by Onsemi

MC10EP33DR2 by Onsemi is a Prescaler & Multivibrator with 3.3V supply, -5.2V power, and 0.44ns propagation delay. Ideal for high-speed applications up to 4GHz in industrial settings due to ECL technology and small outline package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 7,500 parts In-Stock

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Flip Electronics

USA . 17,500 parts In-Stock

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Vyrian

USA . 11,511 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4,902 parts In-Stock

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Bristol Electronics

USA . 4,902 parts In-Stock

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Dan-Mar Components

USA . 4,902 parts In-Stock

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Digiode

USA . 962 parts In-Stock

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Electronic Expediters

USA . 399 parts In-Stock

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AZTECH Wire

Italy . 637 parts In-Stock

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$17.890

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Component Stockers USA

USA . 271 parts In-Stock

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$99.990

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Kepictronics

USA . 10,555 parts In-Stock

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TANS Electronics

Latvia . 7,939 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 4,158 parts In-Stock

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Problanco Electronics

Mexico . 4,121 parts In-Stock

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RC Electronics

USA . 3,960 parts In-Stock

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$13.520

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$12.750

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$12.490

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$12.490

SupplyDigital Components

Austria . 3,483 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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Corphita

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Corohmni

South Africa . 476 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 3 parts In-Stock

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Overview

Unlock the power of precision with the Onsemi MC10EP33DR2 Prescaler & Multivibrators. Crafted with superior quality and cutting-edge technology, this product boasts unparalleled performance and reliability. From data communication to industrial applications, this versatile device offers unmatched value, delivering precise results and seamless operation. Trust in Onsemi's expertise and elevate your projects with the MC10EP33DR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product.

Surface Mount: YES

Allows for easy installation and integration into circuits.

Nominal Supply Voltage / Vsup (V): 3.3

Matches the typical voltage requirements in many electronic systems.

Propagation Delay (tpd): 0.44 ns

Offers fast signal processing and response times.

Maximum Operating Temperature: 85 °C

Ensures the product can operate effectively under various environmental conditions.

Maximum Frequency At Nominal Supply: 4000000000 Hz

Supports high-frequency operation for demanding applications.

Technology: ECL

Utilizes Emitter-Coupled Logic technology known for high-speed performance.

Technical Specifications

Prescaler & Multivibrators MC10EP33DR2 attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

34 mA

Propagation Delay (tpd):

.44 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Minimum fmax:

2500 MHz

Trade Compliance

MC10EP33DR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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