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MC100LVEL32DTR2

Onsemi

MC100LVEL32DTR2 by Onsemi

MC100LVEL32DTR2 by Onsemi is a Prescaler & Multivibrator with 8 terminals, ECL technology, and 0.6 ns propagation delay. It operates at -40 to 85 °C with a max frequency of 2.2 GHz. Ideal for industrial applications requiring high-speed signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,385 parts In-Stock

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Digiode

USA . 927 parts In-Stock

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927

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AZTECH Wire

Italy . 1,051 parts In-Stock

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$13.570

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1,051

$13.570

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Component Stockers USA

USA . 570 parts In-Stock

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$99.990

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570

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QUARKTWIN TECHNOLOGY LTD

USA . 19,322 parts In-Stock

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SupplyDigital Components

Austria . 7,668 parts In-Stock

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TANS Electronics

Latvia . 3,186 parts In-Stock

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Problanco Electronics

Mexico . 1,393 parts In-Stock

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Corphita

USA . 1,327 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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Kulean Microsystems

USA . 631 parts In-Stock

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Microchip USA

USA . 163 parts In-Stock

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Corohmni

South Africa . 64 parts In-Stock

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Overview

Unleash the power of precision with the MC100LVEL32DTR2 by Onsemi. Crafted with superior quality and cutting-edge technology, this Prescaler & Multivibrator is designed for unparalleled performance in a variety of applications. From telecommunications to industrial automation, this versatile component offers unmatched value and reliability. Elevate your projects with the exceptional benefits and advantages that only Onsemi can deliver. Experience innovation at its finest with the MC100LVEL32DTR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the prescaler & multivibrator, ensuring long-term reliability.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient operation and performance of the product.

Propagation Delay (tpd): 0.6 ns

Low propagation delay ensures fast signal processing and minimal lag in data transmission.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments with varying operating conditions.

Maximum Frequency At Nominal Supply: 2200000000 Hz

High maximum frequency allows for fast signal processing and reliable performance in high-speed applications.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed and low-power consumption, ideal for demanding electronic systems.

Technical Specifications

Prescaler & Multivibrators MC100LVEL32DTR2 attributes and parameters. Explore more Prescaler & Multivibrators devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2200000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Data/Clock Inputs:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Minimum fmax:

2400 MHz

Trade Compliance

MC100LVEL32DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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