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MAX708TESA-TG

Onsemi

MAX708TESA-TG by Onsemi

MAX708TESA-TG by Onsemi is a power management IC with a nominal voltage of 3.3V and a max operating temperature of 85°C. It is commonly used as a power supply support circuit in industrial applications.

Median Price

$0.615

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 117,520 parts In-Stock

1+ parts

$0.420

100+ parts

$0.410

1k+ parts

$0.400

10k+ parts

-

117,520

$0.420

$0.410

$0.400

-

Arrow

USA . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.810

50,000

-

-

-

$0.810

Distributors (In-Stock)

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Digiode

USA . 1,673 parts In-Stock

1+ parts

$0.327

100+ parts

-

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1,673

$0.327

-

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Nova Conductors

Japan . 72 parts In-Stock

1+ parts

$0.467

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72

$0.467

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Mobius Materials

USA . 795 parts In-Stock

1+ parts

$0.620

100+ parts

$0.490

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-

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795

$0.620

$0.490

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Flip Electronics

USA . 30,000 parts In-Stock

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30,000

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Chip Stock

USA . 4,294 parts In-Stock

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4,294

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Inventory MP

USA . 2,416 parts In-Stock

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2,416

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Bristol Electronics

USA . 2,416 parts In-Stock

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2,416

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Vyrian

USA . 2,066 parts In-Stock

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2,066

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Component Sense

UK . 1,599 parts In-Stock

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1,599

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Martec Srl

Italy . 460 parts In-Stock

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460

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ComSIT Distribution GmbH

Germany . 7 parts In-Stock

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7

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Distributors (Availability)

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Ampacity Inc.

Singapore . 24,989 parts In-Stock

1+ parts

$0.292

100+ parts

-

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24,989

$0.292

-

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Semicontronic

India . 24,867 parts In-Stock

1+ parts

$0.292

100+ parts

$0.285

1k+ parts

$0.283

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24,867

$0.292

$0.285

$0.283

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Corphita

USA . 2,412 parts In-Stock

1+ parts

$0.310

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2,412

$0.310

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Vigor

Singapore . 33,557 parts In-Stock

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$0.310

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33,557

$0.310

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Corohmni

South Africa . 175 parts In-Stock

1+ parts

$0.344

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175

$0.344

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Continental Prestige Electronics

USA . 3,073 parts In-Stock

1+ parts

$0.467

100+ parts

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$0.458

3,073

$0.467

-

-

$0.458

Argo Parts USA

USA . 1,025 parts In-Stock

1+ parts

$0.467

100+ parts

-

1k+ parts

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10k+ parts

$0.453

1,025

$0.467

-

-

$0.453

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$0.476

100+ parts

$0.476

1k+ parts

$0.476

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10

$0.476

$0.476

$0.476

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AZTECH Wire

Italy . 577 parts In-Stock

1+ parts

$8.760

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577

$8.760

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Aztec Data Supply Inc.

USA . 279 parts In-Stock

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$14.454

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279

$14.454

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Perfect Parts

USA . 60,297 parts In-Stock

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RC Electronics

USA . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,243 parts In-Stock

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Microchip USA

USA . 10,018 parts In-Stock

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Problanco Electronics

Mexico . 5,636 parts In-Stock

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5,636

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A-Z Elektronik GmbH

Germany . 5,370 parts In-Stock

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5,370

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 4,291 parts In-Stock

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4,291

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Kulean Microsystems

USA . 4,210 parts In-Stock

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4,210

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SupplyDigital Components

Austria . 3,795 parts In-Stock

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3,795

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UHIMA Technologies

Türkiye . 782 parts In-Stock

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782

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Formix International (Excess)

India . 241 parts In-Stock

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241

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Infinite Electronics LLP (Excess)

. 241 parts In-Stock

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241

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Metaverse IC Inc.

Canada . 220 parts In-Stock

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220

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$0.458

1k+ parts

$0.444

10k+ parts

$0.434

100

-

$0.458

$0.444

$0.434

Overview

Discover the MAX708TESA-TG by Onsemi, a high-quality Power Management IC designed to enhance your applications. With its small outline package and wide operating temperature range, this product offers tremendous value and benefits to customers. Manufactured by Onsemi, a trusted name in the industry, you can be assured of its reliability and performance. Whether you need power supply support or efficient circuit management, the MAX708TESA-TG is the perfect solution. Experience the advantages of this innovative product and take your applications to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and resistant to environmental factors, making this power management IC suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation, saving time and effort during assembly.

No. of Functions: 1

With a single function, this power management IC simplifies circuit design and reduces complexity.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of space on PCBs, maximizing design flexibility.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with a wide range of electronic devices, making it a versatile choice.

Power Supplies (V): 1.2/5

This power management IC supports multiple power supplies, providing flexibility in voltage requirements for different components in the system.

No. of Terminals: 8

The 8 terminals offer sufficient connectivity options, allowing for easy integration with other circuit components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this power management IC can withstand rigorous operating conditions, ensuring reliable and stable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this IC suitable for use in extreme environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and solderability, ensuring reliable electrical connections.

Terminal Position: DUAL

The dual terminal position allows for flexible PCB mounting options, accommodating different design layouts.

Maximum Seated Height: 1.75 mm

The compact maximum seated height minimizes the overall height of the circuit, suitable for slim and space-constrained applications.

Width (mm): 3.9 mm

With a narrow width, this power management IC can be easily integrated into compact circuit designs.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC serves as a power supply support circuit, providing robust and efficient power management capabilities.

Minimum Supply Voltage (Vsup): 1 V

The low minimum supply voltage allows for operation in low-power applications, enhancing energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper solder reflow during assembly, enhancing manufacturing reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature allows for reliable soldering during assembly processes, ensuring strong and durable connections.

Length: 4.9 mm

The compact length of 4.9 mm saves precious board space, enabling efficient PCB layout designs.

Nominal Threshold Voltage (V): +3.08V

The nominal threshold voltage of +3.08V ensures precise voltage detection and regulation, contributing to stable system operation.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this power management IC meets stringent temperature requirements, ensuring reliable performance in harsh environments.

Maximum Supply Current (Isup): 0.028 mA

The low maximum supply current minimizes power consumption, making this IC energy-efficient.

No. of Channels: 1

With a single channel, this power management IC is suitable for applications requiring a single power pathway or control.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and reliable soldering, simplifying manufacturing processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables precise and space-saving PCB layout, facilitating efficient circuit design.

Moisture Sensitivity Level (MSL): 1

This power management IC has a moisture sensitivity level of 1, indicating it has excellent resistance to moisture-related issues during storage and handling.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5 V provides compatibility with a wide range of power sources and systems.

Technical Specifications

Power Management ICs MAX708TESA-TG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.028 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

MAX708TESA-TG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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