Loading...

MAX708TCUA-TG

Onsemi

MAX708TCUA-TG by Onsemi

MAX708TCUA-TG by Onsemi is a Power Management IC with 3.3V nominal voltage, 1.2/5V power supplies, and -40 to 85 °C operating temperature range. It is used in industrial applications for power supply support circuits due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 11,418 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,418

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 9,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,805

-

-

-

-

Bristol Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Vyrian

USA . 7,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,101

-

-

-

-

Chip Stock

USA . 2,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,769

-

-

-

-

Digiode

USA . 1,565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 802 parts In-Stock

1+ parts

$0.890

100+ parts

-

1k+ parts

-

10k+ parts

-

802

$0.890

-

-

-

Corohmni

South Africa . 196 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$1.150

-

-

-

Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.428

100+ parts

$1.299

1k+ parts

$1.171

10k+ parts

-

600

$1.428

$1.299

$1.171

-

AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$9.330

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$9.330

-

-

-

Component Stockers USA

USA . 257 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$99.990

-

-

-

Perfect Parts

USA . 8,964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,964

-

-

-

-

Lixinc

USA . 8,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,568

-

-

-

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

TANS Electronics

Latvia . 5,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,543

-

-

-

-

Problanco Electronics

Mexico . 3,834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,834

-

-

-

-

SupplyDigital Components

Austria . 3,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,695

-

-

-

-

Microchip USA

USA . 3,053 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,053

-

-

-

-

Corphita

USA . 2,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,056

-

-

-

-

Kulean Microsystems

USA . 958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

958

-

-

-

-

UHIMA Technologies

Türkiye . 213 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

213

-

-

-

-

Overview

Enhance your power management capabilities with the MAX708TCUA-TG by Onsemi. Designed with precision and reliability in mind, this Power Management IC offers unmatched quality and performance. Perfect for a variety of applications, this product provides superior voltage regulation and efficiency. With Onsemi's reputation for excellence in manufacturing, you can trust that the MAX708TCUA-TG will deliver consistent and reliable power management solutions. Upgrade your systems today and experience the value and benefits that this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into various electronic applications, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common voltage used in many electronic devices, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this Power Management IC can operate reliably in demanding environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and conductivity, ensuring a reliable electrical connection for the Power Management IC.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm allows for compact designs and space-saving installation of the Power Management IC in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation means that this Power Management IC is suitable for use in industrial settings where temperature fluctuations may occur.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting of the Power Management IC on circuit boards, maximizing space efficiency.

Technical Specifications

Power Management ICs MAX708TCUA-TG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.028 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

MAX708TCUA-TG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 21