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M74VHC1GT66DTT1G

Onsemi

M74VHC1GT66DTT1G by Onsemi

M74VHC1GT66DTT1G by Onsemi is a CMOS SPST switch with 5 terminals, operating at temperatures from -55 to 125°C. It has a max on-state resistance of 60 ohm and nominal off-state isolation of 80 dB. Ideal for military applications requiring fast switching times (50 ns) and low power supplies (2-5 V).

Median Price

$0.121

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 2 parts In-Stock

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$0.170

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$0.170

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Mouser Electronics

USA . 245,014 parts In-Stock

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$0.075

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$0.075

EBV Elektronik

Germany . 66,000 parts In-Stock

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Flip Electronics (Authorized)

USA . 14,687 parts In-Stock

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DigiKey

USA . 12,000 parts In-Stock

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Chip1Stop

Japan . 4,529 parts In-Stock

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$0.116

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$0.086

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$0.076

4,529

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$0.076

Element14

Singapore . 2,813 parts In-Stock

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$0.126

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$0.103

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$0.079

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$0.079

Arrow

USA . 11 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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$0.102

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500

$0.102

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Maritex

Poland . 17 parts In-Stock

1+ parts

$0.527

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$0.135

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$0.086

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17

$0.527

$0.135

$0.086

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Vyrian

USA . 39,662 parts In-Stock

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Flip Electronics

USA . 8,687 parts In-Stock

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Dan-Mar Components

USA . 6,924 parts In-Stock

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Bristol Electronics

USA . 6,729 parts In-Stock

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$0.225

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$0.135

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$0.068

6,729

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$0.225

$0.135

$0.068

Digiode

USA . 2,317 parts In-Stock

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Microfarads

USA . 76 parts In-Stock

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Ampacity Inc.

Singapore . 39,680 parts In-Stock

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$0.064

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39,680

$0.064

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Corohmni

South Africa . 96 parts In-Stock

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$0.075

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Argo Parts USA

USA . 3,453 parts In-Stock

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$0.102

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$0.099

3,453

$0.102

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$0.099

Bastille Electronics

Australia . 65 parts In-Stock

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$0.102

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$0.097

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$0.092

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$0.091

65

$0.102

$0.097

$0.092

$0.091

Advanced Electronics

New Zealand . 600 parts In-Stock

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$5.883

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$5.354

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$4.824

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$5.883

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$4.824

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Lixinc

USA . 17,312 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,660 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,440 parts In-Stock

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Continental Prestige Electronics

USA . 4,395 parts In-Stock

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$0.137

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$0.069

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$0.063

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TANS Electronics

Latvia . 3,806 parts In-Stock

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SupplyDigital Components

Austria . 3,712 parts In-Stock

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Problanco Electronics

Mexico . 3,596 parts In-Stock

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Kepictronics

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Corphita

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Kulean Microsystems

USA . 1,291 parts In-Stock

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UHIMA Technologies

Türkiye . 789 parts In-Stock

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Microchip USA

USA . 676 parts In-Stock

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Overview

Maximize your circuit performance with the Onsemi M74VHC1GT66DTT1G multiplexer and switch. Engineered by a trusted manufacturer, this versatile component offers seamless integration and reliable operation in various applications. With its compact design and superior technology, this product delivers unmatched value and efficiency to customers. Upgrade your electronic systems today with the M74VHC1GT66DTT1G and experience enhanced functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexers & switches, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and facilitating mass production.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal supply voltage of 3 V ensures compatibility with a wide range of electronic systems and devices.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125°C allows the multiplexers & switches to withstand harsh environmental conditions and heavy usage without malfunctioning.

Technology: CMOS

Being CMOS technology ensures low power consumption and high noise immunity, making the multiplexers & switches energy-efficient and reliable in noisy environments.

Technical Specifications

Multiplexers & Switches M74VHC1GT66DTT1G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

80 dB

Maximum On-state Resistance (Ron):

60 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

50 ns

Maximum Switch-on Time:

50 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

M74VHC1GT66DTT1G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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