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LV5696P

Onsemi

LV5696P by Onsemi

LV5696P by Onsemi is a BICMOS technology IC with 15 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 7-16V and comes in an industrial-grade rectangular package. Ideal for consumer circuits, this IC features zig-zag terminal positioning and measures 21.6mm x 3mm x 14.55mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,472 parts In-Stock

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Digiode

USA . 1,244 parts In-Stock

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Problanco Electronics

Mexico . 7,219 parts In-Stock

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TANS Electronics

Latvia . 6,186 parts In-Stock

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SupplyDigital Components

Austria . 4,433 parts In-Stock

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Kulean Microsystems

USA . 2,964 parts In-Stock

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Corphita

USA . 957 parts In-Stock

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Corohmni

South Africa . 259 parts In-Stock

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UHIMA Technologies

Türkiye . 146 parts In-Stock

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Overview

Discover the LV5696P by Onsemi, a top-quality consumer circuit designed to elevate your electronic projects. With a durable plastic/epoxy package body and zig-zag terminal position, this IC offers reliability and efficiency in various applications. Experience the unmatched value and benefits of Onsemi's innovative technology, providing a wide operating temperature range from -40 °C to 85°C. Upgrade your designs with the LV5696P and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and integration of the IC into various electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the IC to function in both high and low temperature conditions, making it versatile for different applications.

Technology: BICMOS

BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption for efficient operation.

Maximum Seated Height: 14.55 mm

The compact size of the IC makes it suitable for space-constrained designs and applications where height clearance is limited.

Minimum Supply Voltage (Vsup): 7 V

The low minimum supply voltage requirement allows for use in battery-operated devices and ensures efficient power consumption.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage tolerance provides flexibility in powering the IC and allows for stable operation even with voltage variations.

Technical Specifications

Other Function Consumer ICs LV5696P attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T15

Length:

21.6 mm

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG, SHRINK PITCH

Maximum Seated Height:

14.55 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Width:

3 mm

Trade Compliance

LV5696P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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