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LV0221CS-TLM-H

Onsemi

LV0221CS-TLM-H by Onsemi

LV0221CS-TLM-H by Onsemi is a Photo IC Sensor with -20 to 85 °C operating temp range. It has 23.4mA max supply current, 5V nominal voltage, and Tin/Silver/Copper terminal finish. Ideal for surface mount applications in various industries.

Median Price

$0.867

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,277 parts In-Stock

1+ parts

-

100+ parts

$0.851

1k+ parts

$0.706

10k+ parts

$0.630

35,277

-

$0.851

$0.706

$0.630

Verical

USA . 19,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.883

10k+ parts

$0.787

19,277

-

-

$0.883

$0.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 750 parts In-Stock

1+ parts

$0.663

100+ parts

-

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750

$0.663

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Flip Electronics

USA . 12,000 parts In-Stock

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12,000

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-

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Vyrian

USA . 7,631 parts In-Stock

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7,631

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,567 parts In-Stock

1+ parts

$0.628

100+ parts

-

1k+ parts

-

10k+ parts

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1,567

$0.628

-

-

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Corohmni

South Africa . 310 parts In-Stock

1+ parts

$0.698

100+ parts

-

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310

$0.698

-

-

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AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$19.450

100+ parts

-

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340

$19.450

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Kepictronics

USA . 42,000 parts In-Stock

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42,000

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TANS Electronics

Latvia . 6,115 parts In-Stock

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6,115

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Problanco Electronics

Mexico . 4,815 parts In-Stock

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4,815

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SupplyDigital Components

Austria . 2,726 parts In-Stock

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2,726

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Kulean Microsystems

USA . 1,521 parts In-Stock

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1,521

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UHIMA Technologies

Türkiye . 313 parts In-Stock

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313

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Overview

Enhance your photo IC sensor applications with the top-quality LV0221CS-TLM-H by Onsemi. Known for its reliability and precision, Onsemi delivers cutting-edge technology that surpasses industry standards. This innovative sensor offers a wide range of benefits, from its durable construction to its efficient performance. Explore endless possibilities in industrial automation, automotive systems, and consumer electronics with this advanced sensor. Upgrade your projects with the LV0221CS-TLM-H and experience unmatched value and excellence.

Feature Benefit Bullets

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for versatility in different environments and usage scenarios, making this sensor suitable for a wide range of applications.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures that the sensor can function effectively even in colder conditions, providing reliability in various climates.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple terminal finishes enhances the durability and conductivity of the sensor, improving its overall performance and longevity.

Maximum Supply Current: 23.4 mA

The low maximum supply current requirement helps in conserving power and energy, making this sensor an energy-efficient choice for users.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a commonly available and stable power source, ensuring compatibility with most systems and ease of integration.

Mounting Feature: SURFACE MOUNT

The surface mount design simplifies the installation process and allows for a compact and space-saving setup, making this sensor convenient for various mounting options.

Technical Specifications

Photo IC Sensors LV0221CS-TLM-H attributes and parameters. Explore more Photo IC Sensors devices from Onsemi

Specs

JESD-609 Code:

e1

Mounting Feature:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Sub-Category:

Photo ICs

Maximum Supply Current:

23.4 mA

Nominal Supply Voltage:

5 V

Terminal Finish:

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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