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LV0104CS-TLM-H

Onsemi

LV0104CS-TLM-H by Onsemi

LV0104CS-TLM-H by Onsemi is a consumer IC with 4 terminals in a square package. It operates b/w -30 to 85 °C, with supply voltage ranging from 2.3V to 3.6V. Ideal for applications requiring fine pitch and thin profile grid array packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,349 parts In-Stock

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Digiode

USA . 320 parts In-Stock

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Chip Stock

USA . 143 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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10

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AZTECH Wire

Italy . 1,150 parts In-Stock

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$20.480

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Perfect Parts

USA . 15,173 parts In-Stock

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Kulean Microsystems

USA . 7,688 parts In-Stock

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Problanco Electronics

Mexico . 6,154 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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SupplyDigital Components

Austria . 2,452 parts In-Stock

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TANS Electronics

Latvia . 1,663 parts In-Stock

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Corphita

USA . 552 parts In-Stock

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UHIMA Technologies

Türkiye . 486 parts In-Stock

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Kepictronics

USA . 67 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Overview

Discover the innovative LV0104CS-TLM-H by Onsemi, a cutting-edge consumer circuit designed to elevate your electronic devices. With a compact square package and high-quality materials, this product offers unmatched performance and reliability. Whether you're looking to enhance your home appliances or upgrade your handheld gadgets, this versatile IC delivers exceptional value and benefits. Trust in Onsemi's reputation for excellence and unlock a world of possibilities with the LV0104CS-TLM-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand tough environmental conditions.

Minimum Operating Temperature: -30 °C

The wide range of operating temperatures allows for flexibility in different usage scenarios.

Terminal Finish: TIN SILVER COPPER

The terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance.

Width: 1.08 mm

The small width of the IC makes it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.3 V

The low minimum supply voltage allows for efficient power consumption in various devices.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables reliable soldering during the manufacturing process.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC has a moderate level of sensitivity to moisture, suitable for typical manufacturing environments.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs LV0104CS-TLM-H attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

1.08 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.68 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.08 mm

Trade Compliance

LV0104CS-TLM-H General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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