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LM2931CDG

Onsemi

LM2931CDG by Onsemi

LM2931CDG by Onsemi is an adjustable positive single output LDO regulator with a max output voltage of 29.5V and a max dropout voltage of 0.6V. It operates at temperatures up to 150°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.

Median Price

$0.226

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 2,300 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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$0.226

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Vyrian

USA . 3,739 parts In-Stock

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Digiode

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Goldney Electronics S.L.

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ACDS - Activité Composants Distribution Service

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North Shore Components

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A2Z Electronics, Inc.

USA . 20 parts In-Stock

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Bristol Electronics

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Corohmni

South Africa . 293 parts In-Stock

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$0.221

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Argo Parts USA

USA . 3,228 parts In-Stock

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$0.226

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$0.219

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Continental Prestige Electronics

USA . 957 parts In-Stock

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$0.226

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Netroflash

USA . 100 parts In-Stock

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Semicontronic

India . 1,966 parts In-Stock

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$2.500

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$2.438

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$2.425

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Aztec Data Supply Inc.

USA . 241 parts In-Stock

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$4.536

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Ampacity Inc.

Singapore . 2,195 parts In-Stock

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$15.500

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AZTECH Wire

Italy . 805 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 6,342 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 2,178 parts In-Stock

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Problanco Electronics

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Corphita

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UHIMA Technologies

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Looking for a reliable solution for your voltage regulation needs? Look no further than the LM2931CDG by Onsemi. With a reputation for superior quality and innovation, Onsemi delivers top-of-the-line adjustable regulators like the LM2931CDG for a wide range of applications. This product offers maximum value with its efficient performance and high level of reliability. Say goodbye to voltage fluctuations and hello to seamless power supply with the LM2931CDG. Trust Onsemi to provide you with the best in class products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this regulator lightweight and durable, perfect for portable electronic devices.

Maximum Dropout Voltage: 1.6 V

With a low dropout voltage, this regulator ensures stable output even when the input voltage is close to the output voltage, making it efficient.

Surface Mount: YES

Being surface mountable, this regulator is easy to install and saves space on the PCB, ideal for compact electronics designs.

Operating Temperature (TJ-Max): 150 °C

With a high operating temperature range, this regulator can withstand harsh environmental conditions, ensuring reliable performance.

Technology: BIPOLAR

The bipolar technology used in this regulator provides precise voltage regulation, making it suitable for high-performance applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into different circuit layouts, enhancing versatility.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and facilitates soldering, ensuring a reliable electrical connection.

Packing Method: RAIL

This regulator is packaged in a rail system, making it convenient for automated assembly processes in mass production.

Minimum Output Voltage: 2.7 V

With a minimum output voltage of 2.7V, this regulator is suitable for powering a wide range of electronic components.

No. of Terminals: 8

The regulator's eight terminals offer flexibility in connecting external components, enhancing its versatility in different circuit configurations.

Technical Specifications

Adjustable Regulators - Positive Single Output LDO LM2931CDG attributes and parameters. Explore more Adjustable Regulators - Positive Single Output LDO devices from Onsemi

Specs

Adjustability:

ADJUSTABLE

Maximum Dropout Voltage-1:

.6 V

Nominal Dropout Voltage-1:

.16 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Maximum Line Regulation (%/V):

1.25

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Operating Temperature (TJ-Max):

150 Cel

Maximum Output Current-1:

.1 A

Maximum Output Voltage-1:

29.5 V

Minimum Output Voltage-1:

2.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

LM2931CDG Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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