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LA76835NM

Onsemi

LA76835NM by Onsemi

LA76835NM by Onsemi is an 80-terminal Receiver IC for audio/video demodulation. It operates b/w -10 °C to 65°C with power supplies of 5V and 9V. This rectangular, surface-mount IC in plastic/epoxy package is ideal for commercial temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,094 parts In-Stock

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Digiode

USA . 1,471 parts In-Stock

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SupplyDigital Components

Austria . 7,089 parts In-Stock

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7,089

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TANS Electronics

Latvia . 1,881 parts In-Stock

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Corphita

USA . 1,406 parts In-Stock

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Kulean Microsystems

USA . 1,018 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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Problanco Electronics

Mexico . 59 parts In-Stock

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Overview

Experience the superior quality and reliability of the LA76835NM by Onsemi, a leading manufacturer in receiver ICs. This versatile audio/video demodulator is perfect for a wide range of applications, offering customers exceptional value and benefits. With its innovative design and advanced technology, this product provides unmatched performance and efficiency, making it the ideal choice for your electronic needs. Trust Onsemi to deliver top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reduces the risk of damage during handling or installation.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly.

General IC Type: AUDIO/VIDEO DEMODULATOR

Designed specifically for audio/video demodulation, ensuring high performance and quality output.

Power Supplies (V): 5,9

Compatible with common power supply voltages, making it versatile for a variety of applications.

No. of Terminals: 80

A higher number of terminals allows for more connections and functionality within the circuit.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving design, ideal for smaller electronic devices.

Maximum Operating Temperature: 65 °C

Can operate at higher temperatures without overheating, ensuring reliable performance in various environments.

Minimum Operating Temperature: -10 °C

Can withstand lower temperatures, making it suitable for use in cold conditions or climate-controlled environments.

Terminal Position: QUAD

Quad terminal position allows for easy connection and integration into the circuit board.

Temperature Grade: COMMERCIAL

Designed for commercial use, meeting industry standards and performance requirements.

Terminal Form: GULL WING

Gull wing terminal form provides a secure and reliable connection to the PCB, reducing the risk of signal loss or failure.

Maximum Supply Current: 33 mA

Can handle a maximum supply current of 33 mA, ensuring stable operation under typical operating conditions.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise and compact layout of the terminals on the PCB, optimizing space and connectivity.

Technical Specifications

Receiver ICs LA76835NM attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PQFP-G80

No. of Terminals:

80

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,9

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

33 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

LA76835NM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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