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HCPL4503TSVM

Onsemi

HCPL4503TSVM by Onsemi

HCPL4503TSVM by Onsemi is a single optocoupler with a max forward current of 0.025A and an isolation voltage of 5000V. It operates b/w 0-70 °C, suitable for logic IC output applications at a data rate of 1MBps. Ideal for surface mounting with matte tin finish in tube packaging.

Median Price

$1.660

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,000 parts In-Stock

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$1.123

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$1.123

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Mouser Electronics

USA . 1,000 parts In-Stock

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$1.580

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$1.100

1k+ parts

$0.778

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1,000

$1.580

$1.100

$0.778

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Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

$1.740

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1,000

$1.740

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DigiKey

USA . 934 parts In-Stock

1+ parts

$2.100

100+ parts

$1.145

1k+ parts

$0.934

10k+ parts

$0.813

934

$2.100

$1.145

$0.934

$0.813

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Verical

USA . 1,000 parts In-Stock

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Digiode

USA . 1,511 parts In-Stock

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$1.071

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$1.071

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Vyrian

USA . 1,128 parts In-Stock

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$1.127

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$1.127

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Chip Stock

USA . 49,000 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 700 parts In-Stock

1+ parts

$0.856

100+ parts

$0.779

1k+ parts

$0.702

10k+ parts

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700

$0.856

$0.779

$0.702

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Corphita

USA . 2,950 parts In-Stock

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$1.014

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$1.014

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Corohmni

South Africa . 244 parts In-Stock

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$1.127

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244

$1.127

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,833 parts In-Stock

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6,833

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Kulean Microsystems

USA . 4,661 parts In-Stock

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SupplyDigital Components

Austria . 2,686 parts In-Stock

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Supply Digital

USA . 1,088 parts In-Stock

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Native Components

USA . 519 parts In-Stock

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519

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TANS Electronics

Latvia . 411 parts In-Stock

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411

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Northwest PG Solutions

USA . 252 parts In-Stock

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252

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UHIMA Technologies

Türkiye . 247 parts In-Stock

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Overview

Unlock a world of possibilities with the HCPL4503TSVM by Onsemi. Crafted with precision and expertise, this optocoupler circuit output offers unparalleled quality and reliability. From industrial automation to medical devices, this product is versatile and adaptable to a wide range of applications. Experience seamless connectivity and enhanced performance with Onsemi's innovative technology. Trust in the value and benefits that this product brings to your projects, and elevate your work to new heights.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration allows for easy integration into circuits without the need for complex setups, making it a user-friendly choice.

Maximum Forward Current: 0.025 A

With a high maximum forward current capacity, this optocoupler circuit output can handle heavy loads effectively.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler, this product is well-suited for interfacing between different logic levels in integrated circuits.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for flexibility in powering this optocoupler circuit output from various sources.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand heat and perform reliably in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this optocoupler circuit output can function even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, enhancing the longevity of this product.

Packing Method: TUBE

Packaged in a tube, this optocoupler circuit output is easy to store, transport, and handle during assembly.

Maximum Isolation Voltage: 5000 V

With a high maximum isolation voltage, this product ensures safe separation between input and output circuits, preventing electrical interference.

Nominal Data Rate: 1 MBps

The high nominal data rate enables fast and efficient communication between connected devices, enhancing overall system performance.

Mounting Feature: SURFACE MOUNT

Designed for surface mounting, this optocoupler circuit output facilitates easy installation on PCBs and saves space in compact electronic designs.

Maximum On State Current: 0.008 A

With a low maximum on-state current, this product helps minimize power consumption and heat generation during operation.

Technical Specifications

Optocoupler Circuit Outputs HCPL4503TSVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, TTL AND CMOS COMPATIBLE, UL APPROVED

Configuration:

SINGLE

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

HCPL4503TSVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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