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HCPL3700SVM

Onsemi

HCPL3700SVM by Onsemi

HCPL3700SVM by Onsemi is a complex optocoupler with a max forward current of 0.05A and max isolation voltage of 5000V. It operates b/w -40 to 85°C, making it suitable for logic IC output applications requiring high isolation levels in surface mount configurations.

Median Price

$1.232

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1,000 parts In-Stock

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$1.232

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1,000

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$1.232

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Distributors (In-Stock)

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Digiode

USA . 1,383 parts In-Stock

1+ parts

$3.458

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1,383

$3.458

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Nova Conductors

Japan . 100 parts In-Stock

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$4.013

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100

$4.013

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Vyrian

USA . 849 parts In-Stock

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849

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 68 parts In-Stock

1+ parts

$0.718

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68

$0.718

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Ampacity Inc.

Singapore . 612 parts In-Stock

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$3.090

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$3.090

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Corphita

USA . 211 parts In-Stock

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$3.276

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$3.276

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Corohmni

South Africa . 418 parts In-Stock

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$3.932

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418

$3.932

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Argo Parts USA

USA . 1,915 parts In-Stock

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$4.013

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Netroflash

USA . 1,000 parts In-Stock

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$4.013

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$3.932

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$4.013

$3.932

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Continental Prestige Electronics

USA . 276 parts In-Stock

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$4.013

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$3.932

276

$4.013

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$3.932

Component Stockers USA

USA . 2,388 parts In-Stock

1+ parts

$7.470

100+ parts

$4.470

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2,388

$7.470

$4.470

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SupplyDigital Components

Austria . 8,209 parts In-Stock

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Kulean Microsystems

USA . 6,791 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 1,728 parts In-Stock

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1,728

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Problanco Electronics

Mexico . 890 parts In-Stock

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890

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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747

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Overview

Experience superior quality and reliability with the HCPL3700SVM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch optocoupler circuit outputs that provide unmatched performance across a wide range of applications. With a maximum isolation voltage of 5000 V and a compact rectangular shape for easy surface mounting, this Logic IC output optocoupler ensures optimal efficiency and safety. Trust Onsemi to deliver innovative solutions that enhance your projects' functionality and value. Elevate your designs with the HCPL3700SVM and experience the difference today.

Feature Benefit Bullets

Configuration: COMPLEX

The complex configuration allows for versatile applications and flexibility in use.

Maximum Forward Current: 0.05 A

With a high maximum forward current, this optocoupler circuit output can handle demanding loads with ease.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

This specific type is ideal for logic IC outputs, ensuring compatibility and reliable performance.

Minimum Supply Voltage: 2 V

The low minimum supply voltage makes this product energy-efficient and suitable for low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this optocoupler circuit output can withstand elevated temperatures without performance degradation.

Shape: RECTANGULAR

The rectangular shape allows for easy placement and integration into circuit designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable operation even in extreme cold conditions.

Packing Method: TUBE

The tube packaging method provides protection during storage and transportation, preventing damage to the product.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage offers enhanced safety and protection against electrical shock hazards.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and saves space on the circuit board.

Maximum On State Current: 0.03 A

With a low maximum on-state current, this optocoupler circuit output helps prevent overload and ensures stable performance.

Technical Specifications

Optocoupler Circuit Outputs HCPL3700SVM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE, TTL COMPATIBLE, IEC-60747-5-5, UL APPROVED

Configuration:

COMPLEX

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.03 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Shape:

RECTANGULAR

Minimum Supply Voltage:

2 V

Trade Compliance

HCPL3700SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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