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HCPL2730SM

Onsemi

HCPL2730SM by Onsemi

HCPL2730SM by Onsemi is a 2-channel logic IC output optocoupler with separate configuration. It has a max isolation voltage of 5000V and can handle a max forward current of 0.02A. Ideal for applications requiring high isolation and surface mounting feature in temperature range from -40 to 100 °C.

Median Price

$2.860

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 995 parts In-Stock

1+ parts

$2.860

100+ parts

$1.550

1k+ parts

$1.190

10k+ parts

$1.030

995

$2.860

$1.550

$1.190

$1.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 555 parts In-Stock

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555

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Digiode

USA . 244 parts In-Stock

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244

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Distributors (Availability)

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Native Components

USA . 604 parts In-Stock

1+ parts

$22.835

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604

$22.835

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Northwest PG Solutions

USA . 1,857 parts In-Stock

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$25.118

100+ parts

$22.607

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1,857

$25.118

$22.607

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Kulean Microsystems

USA . 7,520 parts In-Stock

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7,520

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Problanco Electronics

Mexico . 5,016 parts In-Stock

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5,016

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TANS Electronics

Latvia . 4,762 parts In-Stock

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4,762

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SupplyDigital Components

Austria . 3,418 parts In-Stock

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3,418

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Supply Digital

USA . 2,236 parts In-Stock

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UHIMA Technologies

Türkiye . 725 parts In-Stock

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Corphita

USA . 446 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the HCPL2730SM by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This optocoupler circuit output is versatile and can be used in a variety of applications. With its separate configuration and two channels, it offers superior functionality and efficiency. Providing maximum isolation voltage of 5000V, this product ensures safety and protection for your equipment. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations. Upgrade your devices today with the HCPL2730SM.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent operation and control of each function, providing flexibility and customization in usage.

Maximum Forward Current: 0.02 A

The high maximum forward current rating ensures reliable and efficient performance, even under high load conditions.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler means it can efficiently interface between different logic levels, making it suitable for a wide range of applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, ensuring reliability in various environments.

Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into circuit designs and provides a compact form factor for space-constrained applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in cold environments, broadening the range of applications where this product can be used.

Maximum Isolation Voltage: 5000 V

With a high isolation voltage rating, this product offers excellent protection against voltage spikes and ensures safe operation in high-voltage applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum On State Current: 0.06 A

The high maximum on-state current rating allows for handling higher current loads, making this product suitable for applications that require robust performance.

Technical Specifications

Optocoupler Circuit Outputs HCPL2730SM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SEPARATE, 2 CHANNELS

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Shape:

RECTANGULAR

Trade Compliance

HCPL2730SM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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