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HCPL0701R2

Onsemi

HCPL0701R2 by Onsemi

HCPL0701R2 by Onsemi is a single optocoupler with a max forward current of 0.02A and min CTR of 400%. It operates b/w -40 to 85°C, has an isolation voltage of 2500V, and can handle a max power dissipation of 0.1W. Ideal for logic IC output applications in surface mount configurations.

Median Price

$1.299

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Chip1Stop

Japan . 1,890 parts In-Stock

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$1.210

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$1.140

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$1.040

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$0.917

1,890

$1.210

$1.140

$1.040

$0.917

Arrow

USA . 2,247 parts In-Stock

1+ parts

$1.218

100+ parts

$1.161

1k+ parts

$1.105

10k+ parts

-

2,247

$1.218

$1.161

$1.105

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Mouser Electronics

USA . 4,047 parts In-Stock

1+ parts

$2.220

100+ parts

$1.390

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$1.180

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$1.070

4,047

$2.220

$1.390

$1.180

$1.070

DigiKey

USA . 7,173 parts In-Stock

1+ parts

$2.710

100+ parts

$1.520

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$1.262

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$1.127

7,173

$2.710

$1.520

$1.262

$1.127

Verical

USA . 2,247 parts In-Stock

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-

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$1.161

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$1.105

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2,247

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$1.105

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Rochester

USA . 305 parts In-Stock

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$1.380

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$1.150

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$1.020

305

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$1.380

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$1.020

Distributors (In-Stock)

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Digiode

USA . 2,152 parts In-Stock

1+ parts

$1.054

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2,152

$1.054

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Nova Conductors

Japan . 67 parts In-Stock

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$1.180

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Flip Electronics

USA . 42,645 parts In-Stock

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Chip Stock

USA . 35,400 parts In-Stock

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ComSIT Distribution GmbH

Germany . 10,000 parts In-Stock

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ComSIT USA

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TME

Poland . 5,000 parts In-Stock

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$0.475

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$0.475

Vyrian

USA . 1,145 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 425 parts In-Stock

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Bristol Electronics

USA . 405 parts In-Stock

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$0.563

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$0.420

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405

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DigiKey Marketplace

USA . 305 parts In-Stock

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305

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Aztec Data Supply Inc.

USA . 2,127 parts In-Stock

1+ parts

$0.596

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2,127

$0.596

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Corohmni

South Africa . 80 parts In-Stock

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$0.822

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80

$0.822

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Ampacity Inc.

Singapore . 1,327 parts In-Stock

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$0.850

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1,327

$0.850

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Semicontronic

India . 999 parts In-Stock

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$0.850

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$0.829

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$0.824

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999

$0.850

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$0.824

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Corphita

USA . 2,078 parts In-Stock

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$0.999

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Component Stockers USA

USA . 8,529 parts In-Stock

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$1.140

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$1.040

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$0.930

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8,529

$1.140

$1.040

$0.930

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Continental Prestige Electronics

USA . 4,470 parts In-Stock

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$1.180

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$1.156

4,470

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Argo Parts USA

USA . 629 parts In-Stock

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Andel Nordic

Denmark . 1,000 parts In-Stock

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$1.230

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$1.180

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Advanced Electronics

New Zealand . 104 parts In-Stock

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$1.369

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$1.260

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 9,540 parts In-Stock

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SupplyDigital Components

Austria . 5,845 parts In-Stock

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Problanco Electronics

Mexico . 5,779 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,370 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 2,853 parts In-Stock

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Supply Digital

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Glotronic Ltd.

UK . 1,740 parts In-Stock

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TANS Electronics

Latvia . 1,508 parts In-Stock

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UHIMA Technologies

Türkiye . 591 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

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Kepictronics

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Overview

Enhance the performance of your circuit outputs with the HCPL0701R2 by Onsemi. As a trusted manufacturer in optocoupler technology, Onsemi delivers top-quality products that meet industry standards. This single configuration optocoupler offers maximum isolation voltage of 2500V and minimum current transfer ratio of 400%, ensuring reliable and secure signal transmission. Ideal for logic IC output applications, this product operates efficiently in temperatures ranging from -40 to 85°C. Upgrade your systems with the HCPL0701R2 and experience enhanced functionality and peace of mind.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies the setup and wiring process, making the product easy to use.

Maximum Forward Current: 0.02 A

Can handle a maximum current of 0.02 A, suitable for low-power applications.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Specifically designed for logic IC output applications, ensuring compatibility and reliable performance.

Maximum Operating Temperature: 85 °C

Operates effectively at temperatures up to 85°C, suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures as low as -40°C, providing flexibility in installation location.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good electrical conductivity and solderability, ensuring a secure connection.

Maximum Power Dissipation: 0.1 W

With a maximum power dissipation of 0.1 W, the product can effectively handle power without overheating.

Minimum Current Transfer Ratio: 400 %

High minimum current transfer ratio of 400% ensures accurate signal transmission between input and output.

Maximum Isolation Voltage: 2500 V

Offers high isolation voltage of 2500 V, providing electrical safety and protection in high-voltage applications.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on PCBs, saving space and enabling efficient circuit layout.

Maximum Forward Voltage: 1.7 V

Low maximum forward voltage of 1.7 V helps in reducing power consumption and heat generation in the circuit.

Maximum On State Current: 0.06 A

Capable of handling a maximum on-state current of 0.06 A, suitable for applications requiring higher current flow.

Technical Specifications

Optocoupler Circuit Outputs HCPL0701R2 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SINGLE

Minimum Current Transfer Ratio:

400 %

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

1.7 V

Maximum Isolation Voltage:

2500 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.06 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.1 W

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

HCPL0701R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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