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HCPL2730SDM

Onsemi

HCPL2730SDM by Onsemi

HCPL2730SDM by Onsemi is a logic IC output optocoupler with 2 separate channels. It has a max forward current of 0.02A and isolation voltage of 5000V. Ideal for applications requiring high-speed signal transmission in harsh environments due to its surface mounting feature.

Median Price

$2.485

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 950 parts In-Stock

1+ parts

$2.170

100+ parts

$1.308

1k+ parts

$1.255

10k+ parts

$1.124

950

$2.170

$1.308

$1.255

$1.124

Mouser Electronics

USA . 697 parts In-Stock

1+ parts

$2.800

100+ parts

$1.500

1k+ parts

$1.250

10k+ parts

$1.140

697

$2.800

$1.500

$1.250

$1.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,510 parts In-Stock

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2,510

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Digiode

USA . 1,371 parts In-Stock

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1,371

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 7,947 parts In-Stock

1+ parts

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7,947

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SupplyDigital Components

Austria . 3,020 parts In-Stock

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3,020

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Supply Digital

USA . 2,620 parts In-Stock

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2,620

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Corphita

USA . 2,605 parts In-Stock

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2,605

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Problanco Electronics

Mexico . 2,523 parts In-Stock

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2,523

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Northwest PG Solutions

USA . 1,799 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.058

10k+ parts

-

1,799

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-

$4.058

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Native Components

USA . 937 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.017

10k+ parts

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937

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$4.017

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UHIMA Technologies

Türkiye . 747 parts In-Stock

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747

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Kulean Microsystems

USA . 467 parts In-Stock

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467

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Corohmni

South Africa . 111 parts In-Stock

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111

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Overview

Experience unparalleled quality and reliability with the HCPL2730SDM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge optocoupler circuit outputs that offer exceptional performance and durability. Ideal for a wide range of applications, this product provides customers with the value, benefits, and advantages they need to succeed in today's competitive market. Trust Onsemi and elevate your projects with the HCPL2730SDM.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent control and isolation of each function, providing flexibility and reliability in operation.

No. of Functions: 2

Having 2 functions in one optocoupler circuit outputs increases the versatility and functionality of the product, allowing for multiple tasks to be handled simultaneously.

Maximum Forward Current: 0.02 A

The high maximum forward current rating of 0.02 A ensures that the product can handle demanding applications with ease, providing stability and efficiency in operation.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler ensures compatibility with a wide range of logic circuits, making it a versatile choice for various electronic applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100 °C allows the product to withstand extreme environmental conditions, ensuring reliable performance even in harsh environments.

Shape: RECTANGULAR

The rectangular shape of the product makes it easy to integrate into circuit designs and assemblies, providing convenience and flexibility in installation.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product can function in cold conditions without any loss in performance, making it suitable for a wide range of applications.

No. of Elements: 2

Having 2 elements in the optocoupler circuit outputs provides redundancy and reliability in operation, ensuring continuous functionality even if one element fails.

Packing Method: TR, 13 INCH

The TR packing method in 13-inch reels allows for efficient handling and storage of the product, making it convenient for manufacturing processes and inventory management.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage rating of 5000 V ensures complete electrical isolation between input and output, enhancing safety and preventing interference in sensitive circuits.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies installation and allows for compact designs, saving space and providing ease of integration into electronic systems.

Maximum On State Current: 0.06 A

The high maximum on-state current rating of 0.06 A allows for reliable operation of the product under heavy loads, ensuring consistent performance in demanding applications.

Technical Specifications

Optocoupler Circuit Outputs HCPL2730SDM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SEPARATE, 2 CHANNELS

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 13 INCH

Shape:

RECTANGULAR

Trade Compliance

HCPL2730SDM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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