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HCPL2730M

Onsemi

HCPL2730M by Onsemi

HCPL2730M by Onsemi is a 2-channel optocoupler with separate configuration. It has a max forward current of 0.02A and isolation voltage of 5000V, suitable for logic IC output applications. With operating temperatures ranging from -40 °C to 100°C, it is designed for through-hole mounting in various electronic circuits.

Median Price

$2.179

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 877 parts In-Stock

1+ parts

$2.640

100+ parts

$1.470

1k+ parts

$1.190

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877

$2.640

$1.470

$1.190

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DigiKey

USA . 440 parts In-Stock

1+ parts

$2.640

100+ parts

$1.475

1k+ parts

$1.223

10k+ parts

$1.113

440

$2.640

$1.475

$1.223

$1.113

Master Electronics

USA . 500 parts In-Stock

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-

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$1.460

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$1.250

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500

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$1.460

$1.250

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Verical

USA . 500 parts In-Stock

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-

100+ parts

$1.718

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$1.471

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500

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$1.718

$1.471

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Distributors (In-Stock)

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Digiode

USA . 2,758 parts In-Stock

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Vyrian

USA . 1,087 parts In-Stock

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1,087

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IBS Electronics

USA . 500 parts In-Stock

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100+ parts

$2.048

1k+ parts

$1.753

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500

-

$2.048

$1.753

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 690 parts In-Stock

1+ parts

$7.510

100+ parts

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690

$7.510

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Problanco Electronics

Mexico . 2,633 parts In-Stock

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Supply Digital

USA . 1,537 parts In-Stock

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SupplyDigital Components

Austria . 1,435 parts In-Stock

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Northwest PG Solutions

USA . 1,346 parts In-Stock

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$7.360

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Kulean Microsystems

USA . 1,249 parts In-Stock

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Corphita

USA . 820 parts In-Stock

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820

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UHIMA Technologies

Türkiye . 757 parts In-Stock

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Corohmni

South Africa . 373 parts In-Stock

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TANS Electronics

Latvia . 229 parts In-Stock

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Overview

Enhance your electronic designs with the HCPL2730M by Onsemi, a top-quality optocoupler circuit output that offers exceptional performance and reliability. Onsemi is known for its advanced manufacturing techniques and dedication to producing high-quality components. This versatile optocoupler is ideal for applications where electrical isolation is crucial, providing peace of mind and ensuring optimal functionality. Trust in the HCPL2730M to deliver value, efficiency, and innovation for your next project.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

The separate channels allow for independent operation of each function, providing flexibility in designing circuit connections.

No. of Functions: 2

Having 2 functions in one optocoupler circuit outputs device can help save space on the circuit board and simplify wiring.

Maximum Forward Current: 0.02 A

The high maximum forward current allows for reliable operation even under heavy loads, ensuring stability in the circuit.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

The logic IC output optocoupler type ensures compatibility with logic circuits, making it an ideal choice for digital applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand heat in various environments and maintain performance under stress.

Shape: RECTANGULAR

The rectangular shape allows for easy placement and installation on the circuit board, making it user-friendly for assembly.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in cold conditions, expanding the range of applications for this product.

No. of Elements: 2

Having 2 elements provides redundancy and backup in case one element fails, improving the reliability of the optocoupler circuit outputs.

Packing Method: TUBE

The tube packing method ensures safe storage and transportation of the product, reducing the risk of damage during handling.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage provides robust electrical insulation, preventing interference and ensuring signal integrity in the circuit.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies installation on the circuit board, offering secure attachment and stability during operation.

Maximum On State Current: 0.06 A

The high maximum on-state current capability allows for efficient switching and control of current flow, enhancing the performance of the optocoupler circuit outputs.

Technical Specifications

Optocoupler Circuit Outputs HCPL2730M attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Configuration:

SEPARATE, 2 CHANNELS

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.06 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Shape:

RECTANGULAR

Trade Compliance

HCPL2730M Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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