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HCPL2601SDM

Onsemi

HCPL2601SDM by Onsemi

HCPL2601SDM by Onsemi is a single optocoupler with a max forward current of 0.05A and an isolation voltage of 5000V, ideal for logic IC output applications. With a nominal response time of 40ns and data rate of 10MBps, it operates b/w -40 to 100°C temperature range. This rectangular-shaped optocoupler features surface mounting method and TR packing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,843 parts In-Stock

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Vyrian

USA . 1,350 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Aztec Data Supply Inc.

USA . 131 parts In-Stock

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$0.640

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$0.640

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Ampacity Inc.

Singapore . 803 parts In-Stock

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$11.100

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803

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AZTECH Wire

Italy . 864 parts In-Stock

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$19.055

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$19.055

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TANS Electronics

Latvia . 8,156 parts In-Stock

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Problanco Electronics

Mexico . 6,885 parts In-Stock

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SupplyDigital Components

Austria . 6,697 parts In-Stock

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Continental Prestige Electronics

USA . 5,100 parts In-Stock

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Kulean Microsystems

USA . 4,823 parts In-Stock

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Argo Parts USA

USA . 4,780 parts In-Stock

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Corphita

USA . 2,242 parts In-Stock

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Supply Digital

USA . 1,029 parts In-Stock

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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Corohmni

South Africa . 128 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the HCPL2601SDM by Onsemi, a top-quality optocoupler circuit output designed to provide reliable and efficient performance. Manufactured by Onsemi, a trusted industry leader known for their cutting-edge technology and innovative solutions, this product offers a wide range of applications in various industries. With its single configuration and high isolation voltage of 5000V, the HCPL2601SDM ensures safety and precision in your projects. Experience the value and benefits of this product firsthand, whether you're working on industrial automation, power control systems, or data communication applications. Trust Onsemi to deliver excellence with the HCPL2601SDM.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easier to integrate into circuits efficiently.

Maximum Forward Current: 0.05 A

High maximum forward current allows for reliable performance under varying conditions.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Logic IC output optocoupler ensures precise and accurate data transmission.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage helps in minimizing power consumption.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the optocoupler can withstand extreme conditions.

Shape: RECTANGULAR

Rectangular shape simplifies installation and fits well in compact spaces.

Nominal Response Time: 40 ns

Fast nominal response time enables quick data transmission.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in cold environments.

Packing Method: TR

TR packing method provides convenience in storage and handling.

Maximum Response Time: 0.0000001 s

Extremely fast maximum response time ensures minimal delays in data transmission.

Maximum Isolation Voltage: 5000 V

High isolation voltage provides secure separation between input and output signals.

Nominal Data Rate: 10 MBps

High nominal data rate allows for rapid information transfer.

Mounting Feature: SURFACE MOUNT

Surface mount feature offers easy and secure installation onto circuit boards.

Maximum On State Current: 0.025 A

Maximum on-state current ensures reliable operation during high power demands.

Technical Specifications

Optocoupler Circuit Outputs HCPL2601SDM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Nominal Data Rate:

10 MBps

Maximum Forward Current:

.05 A

Maximum Isolation Voltage:

5000 V

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Maximum Response Time:

.0000001 s

Nominal Response Time:

40 ns

Shape:

RECTANGULAR

Minimum Supply Voltage:

4.5 V

Trade Compliance

HCPL2601SDM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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