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HCPL2530SM

Onsemi

HCPL2530SM by Onsemi

HCPL2530SM by Onsemi is a logic IC output optocoupler with 2 separate channels. It features a max forward current of 0.025A and max isolation voltage of 5000V. Ideal for applications requiring high-speed data transmission in environments with temperatures ranging from 0 to 70°C.

Median Price

$1.310

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 985 parts In-Stock

1+ parts

$2.180

100+ parts

$1.200

1k+ parts

$0.890

10k+ parts

-

985

$2.180

$1.200

$0.890

-

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

$0.872

10k+ parts

$0.777

3,000

-

$1.050

$0.872

$0.777

DigiKey

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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$1.310

10k+ parts

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3,000

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-

$1.310

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Distributors (In-Stock)

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Digiode

USA . 1,208 parts In-Stock

1+ parts

$0.816

100+ parts

-

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1,208

$0.816

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.118

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150

$1.118

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DigiKey Marketplace

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Vyrian

USA . 1,970 parts In-Stock

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1,970

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Flip Electronics

USA . 980 parts In-Stock

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980

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,162 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

-

10k+ parts

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2,162

$0.730

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-

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Corphita

USA . 1,600 parts In-Stock

1+ parts

$0.773

100+ parts

-

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1,600

$0.773

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Corohmni

South Africa . 477 parts In-Stock

1+ parts

$0.859

100+ parts

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477

$0.859

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Bastille Electronics

Australia . 53 parts In-Stock

1+ parts

$1.118

100+ parts

$1.062

1k+ parts

$1.009

10k+ parts

$0.995

53

$1.118

$1.062

$1.009

$0.995

Continental Prestige Electronics

USA . 1,882 parts In-Stock

1+ parts

$1.118

100+ parts

-

1k+ parts

-

10k+ parts

$1.096

1,882

$1.118

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-

$1.096

Argo Parts USA

USA . 1,662 parts In-Stock

1+ parts

$1.118

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1,662

$1.118

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Andel Nordic

Denmark . 244 parts In-Stock

1+ parts

$3.711

100+ parts

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1k+ parts

$3.562

10k+ parts

$3.562

244

$3.711

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$3.562

$3.562

QUARKTWIN TECHNOLOGY LTD

USA . 19,184 parts In-Stock

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19,184

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TANS Electronics

Latvia . 3,765 parts In-Stock

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3,765

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Supply Digital

USA . 2,599 parts In-Stock

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2,599

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SupplyDigital Components

Austria . 1,960 parts In-Stock

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1,960

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Problanco Electronics

Mexico . 1,524 parts In-Stock

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1,524

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UHIMA Technologies

Türkiye . 554 parts In-Stock

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554

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Kulean Microsystems

USA . 266 parts In-Stock

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266

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Overview

Discover the powerful HCPL2530SM by Onsemi, a top-of-the-line optocoupler circuit output with separate, 2-channel configuration. Designed with precision and reliability in mind, this logic IC output optocoupler offers customers unparalleled quality and performance. Ideal for a wide range of applications, this product provides seamless communication between different systems while ensuring maximum isolation voltage of 5000V. Experience the value and benefits that this innovative device brings to your projects, setting you apart from the competition. Elevate your designs with Onsemi's HCPL2530SM and unlock a world of possibilities.

Feature Benefit Bullets

Configuration: SEPARATE, 2 CHANNELS

Having separate channels allows for independent control or isolation of two different signals, making this product versatile for various applications.

Maximum Forward Current: 0.025 A

The high maximum forward current capability enables this optocoupler to handle higher loads without overheating or malfunctioning.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Being a logic IC output optocoupler ensures that the signals transmitted are accurately converted and compatible with logic ICs, making it suitable for digital circuits.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement allows for flexibility in power supply options and can be easily integrated into existing systems.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this optocoupler can withstand elevated temperatures without affecting performance, ensuring reliable operation in various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable and secure connection, preventing corrosion and ensuring long-term reliability of the product.

No. of Elements: 2

Having two elements allows for dual-channel functionality or redundancy, enhancing system reliability and performance.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage provides effective electrical insulation between input and output, ensuring safety and preventing signal interference.

Nominal Data Rate: 1 MBps

The high nominal data rate enables fast and reliable data transmission between input and output, making this optocoupler ideal for high-speed digital communication applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum On State Current: 0.008 A

The low maximum on-state current ensures efficient power consumption and prevents overloading of connected devices, making this optocoupler energy-efficient and safe to use.

Technical Specifications

Optocoupler Circuit Outputs HCPL2530SM attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

TTL AND CMOS COMPATIBLE, UL APPROVED

Configuration:

SEPARATE, 2 CHANNELS

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

2

No. of Functions:

2

Maximum On State Current:

.008 A

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

HCPL2530SM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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