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FTL7522L6X

Onsemi

FTL7522L6X by Onsemi

TIMER, PROGRAMMABLE; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$0.277

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 99,819 parts In-Stock

1+ parts

-

100+ parts

$0.277

1k+ parts

$0.230

10k+ parts

$0.205

99,819

-

$0.277

$0.230

$0.205

DigiKey

USA . 75,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.350

10k+ parts

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75,000

-

-

$0.350

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Verical

USA . 75,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.257

75,000

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-

-

$0.257

Distributors (In-Stock)

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Digiode

USA . 2,565 parts In-Stock

1+ parts

$0.217

100+ parts

-

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2,565

$0.217

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Vyrian

USA . 2,032 parts In-Stock

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$0.228

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2,032

$0.228

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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5,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 836 parts In-Stock

1+ parts

$0.205

100+ parts

-

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836

$0.205

-

-

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Corohmni

South Africa . 149 parts In-Stock

1+ parts

$0.228

100+ parts

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149

$0.228

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Component Stockers USA

USA . 132,205 parts In-Stock

1+ parts

$0.240

100+ parts

$0.220

1k+ parts

$0.200

10k+ parts

$0.200

132,205

$0.240

$0.220

$0.200

$0.200

Perfect Parts

USA . 156,886 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 65,000 parts In-Stock

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65,000

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

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36,530

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QUARKTWIN TECHNOLOGY LTD

USA . 7,227 parts In-Stock

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7,227

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Kulean Microsystems

USA . 6,716 parts In-Stock

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6,716

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Microchip USA

USA . 6,290 parts In-Stock

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6,290

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Northwest PG Solutions

USA . 1,721 parts In-Stock

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1,721

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Problanco Electronics

Mexico . 1,590 parts In-Stock

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1,590

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UHIMA Technologies

Türkiye . 638 parts In-Stock

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638

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Supply Digital

USA . 591 parts In-Stock

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591

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Native Components

USA . 521 parts In-Stock

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521

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SupplyDigital Components

Austria . 287 parts In-Stock

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287

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TANS Electronics

Latvia . 108 parts In-Stock

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108

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Technical Specifications

Timers & Real-Time Clocks FTL7522L6X attributes and parameters. Explore more Timers & Real-Time Clocks devices from Onsemi

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

FTL7522L6X Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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