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FSL336LRD

Onsemi

FSL336LRD by Onsemi

FSL336LRD by Onsemi is a switching regulator with 7 terminals, operating at -40 to 125 °C. It features a max output current of 1.8A and uses pulse width modulation control technique. Ideal for automotive applications due to its compact size (9.652mm x 7.62mm) and wide input voltage range (85-265V).

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Northwest PG Solutions

USA . 2,227 parts In-Stock

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SupplyDigital Components

Austria . 7,141 parts In-Stock

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Kulean Microsystems

USA . 5,349 parts In-Stock

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Problanco Electronics

Mexico . 2,531 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 709 parts In-Stock

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TANS Electronics

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Native Components

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Overview

Looking for a reliable and high-quality solution for your switching regulators and controllers needs? Look no further than the FSL336LRD by Onsemi. With its advanced technology and automotive-grade temperature grade, this product offers unmatched performance and durability. Perfect for various applications, this switching regulator ensures a stable power supply with maximum efficiency. Trust Onsemi to deliver cutting-edge solutions that meet and exceed your expectations. Experience the value and benefits of the FSL336LRD today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Nominal Supply Voltage (Vsup): 15 V

Suitable for applications where a 15V supply voltage is required.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration and space-saving on the PCB.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, making it suitable for a variety of applications.

Control Mode: CURRENT-MODE

Current-mode control provides better transient response and easier compensation.

Technology: MOS

The use of MOS technology ensures high efficiency and reliability in switching operations.

Control Technique: PULSE WIDTH MODULATION

PWM control allows for precise regulation of output voltage and current, improving overall performance.

Switcher Config: BUCK

The buck configuration provides efficient power conversion for step-down voltage applications.

Technical Specifications

Switching Regulators & Controllers FSL336LRD attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

265 V

Minimum Input Voltage:

85 V

Nominal Input Voltage:

230 V

JESD-30 Code:

R-PDIP-T7

Length:

9.652 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP7/8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.937 mm

Maximum Supply Current (Isup):

1.3 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Switcher Config:

BUCK

Maximum Switching Frequency:

55 kHz

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL336LRD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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