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FSL206MRBN

Onsemi

FSL206MRBN by Onsemi

FSL206MRBN by Onsemi is a switching controller with 8 terminals, operating b/w -40 to 115 °C. It features a max output current of 1.5A and operates at a frequency of 73 kHz. Ideal for industrial applications requiring pulse width modulation control in an inline package style.

Median Price

$0.593

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$0.593

1k+ parts

$0.492

10k+ parts

$0.439

41

-

$0.593

$0.492

$0.439

Distributors (In-Stock)

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Digiode

USA . 1,008 parts In-Stock

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$0.462

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$0.462

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Vyrian

USA . 8,872 parts In-Stock

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Bristol Electronics

USA . 2,463 parts In-Stock

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Dan-Mar Components

USA . 2,463 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,500 parts In-Stock

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Corphita

USA . 1,507 parts In-Stock

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$0.437

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$0.437

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Corohmni

South Africa . 116 parts In-Stock

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$0.486

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Perfect Parts

USA . 9,264 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Kulean Microsystems

USA . 5,342 parts In-Stock

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SupplyDigital Components

Austria . 3,501 parts In-Stock

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TANS Electronics

Latvia . 1,832 parts In-Stock

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Supply Digital

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Northwest PG Solutions

USA . 1,089 parts In-Stock

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$3.980

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UHIMA Technologies

Türkiye . 947 parts In-Stock

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Problanco Electronics

Mexico . 715 parts In-Stock

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Microchip USA

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Native Components

USA . 168 parts In-Stock

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$3.939

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Overview

Experience the power of the FSL206MRBN from Onsemi, a cutting-edge switching regulator that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is perfect for a wide range of applications. With its innovative design and advanced features, the FSL206MRBN provides customers with exceptional value and benefits. Say goodbye to performance issues and inefficiencies – choose the FSL206MRBN for a seamless and reliable experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Maximum Output Current: 1.5 A

Capable of handling high current loads, making it suitable for various applications that require higher power output.

Maximum Switching Frequency: 73 kHz

High switching frequency allows for efficient power conversion, reducing energy loss and heat generation.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides precise regulation of output voltage, improving the overall performance and stability of the system.

Nominal Input Voltage: 10 V

Compatible with a wide range of input voltages, making it versatile for different power supply configurations.

Technical Specifications

Switching Regulators & Controllers FSL206MRBN attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Nominal Input Voltage:

10 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.415 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

SINGLE

Maximum Switching Frequency:

73 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

FSL206MRBN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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