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FSAM10SM60A

Onsemi

FSAM10SM60A by Onsemi

FSAM10SM60A by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 13.5V to 16.5V, and temperature grade suitable for automotive applications. It features a rectangular package style measuring 34.8mm x 60mm x 8.2mm, designed as an AC motor controller with hybrid technology for dual terminal position through-hole assembly.

Median Price

$18.913

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 141 parts In-Stock

1+ parts

-

100+ parts

$15.130

1k+ parts

$13.540

10k+ parts

$12.740

141

-

$15.130

$13.540

$12.740

DigiKey

USA . 141 parts In-Stock

1+ parts

-

100+ parts

$19.910

1k+ parts

-

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141

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$19.910

-

-

Verical

USA . 48 parts In-Stock

1+ parts

-

100+ parts

$18.913

1k+ parts

$16.925

10k+ parts

$15.925

48

-

$18.913

$16.925

$15.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,024 parts In-Stock

1+ parts

$16.008

100+ parts

-

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2,024

$16.008

-

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Vyrian

USA . 3,917 parts In-Stock

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3,917

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DigiKey Marketplace

USA . 141 parts In-Stock

1+ parts

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141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 636 parts In-Stock

1+ parts

$5.940

100+ parts

-

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-

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636

$5.940

-

-

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Andel Nordic

Denmark . 170 parts In-Stock

1+ parts

$9.548

100+ parts

-

1k+ parts

$9.166

10k+ parts

$9.166

170

$9.548

-

$9.166

$9.166

Corphita

USA . 2,784 parts In-Stock

1+ parts

$15.165

100+ parts

-

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2,784

$15.165

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Corohmni

South Africa . 464 parts In-Stock

1+ parts

$16.850

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-

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464

$16.850

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Microchip USA

USA . 4,906 parts In-Stock

1+ parts

$45.280

100+ parts

$44.630

1k+ parts

$44.310

10k+ parts

$43.980

4,906

$45.280

$44.630

$44.310

$43.980

Kulean Microsystems

USA . 5,406 parts In-Stock

1+ parts

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5,406

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SupplyDigital Components

Austria . 2,887 parts In-Stock

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2,887

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Northwest PG Solutions

USA . 2,261 parts In-Stock

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$5.821

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2,261

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$5.821

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Supply Digital

USA . 1,716 parts In-Stock

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1,716

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Problanco Electronics

Mexico . 1,175 parts In-Stock

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1,175

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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567

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TANS Electronics

Latvia . 490 parts In-Stock

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490

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Overview

Unleash the power of precise motion control with the FSAM10SM60A by Onsemi. Crafted with top-notch technology and expertise, this AC motor controller is designed to elevate your automotive applications to new heights. With a wide operating temperature range and a compact package style, this IC offers unparalleled performance and reliability. Experience seamless integration and optimal efficiency with the FSAM10SM60A, your ultimate solution for motion control needs. Elevate your projects with Onsemi's quality and precision today.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing systems and compact designs.

Nominal Supply Voltage (Vsup): 15 V

The 15V supply voltage provides a stable power source for the motion control IC, ensuring reliable performance.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options, enabling the IC to be used in various applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this IC can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20°C ensures that the IC can operate in cold environments without any issues.

Technology: HYBRID

The hybrid technology used in this IC combines the advantages of different technologies, providing enhanced performance and efficiency.

Maximum Supply Voltage (Vsup): 16.5 V

The maximum supply voltage of 16.5V gives some headroom for power fluctuations, increasing the overall stability of the IC.

Technical Specifications

Motion Control ICs FSAM10SM60A attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T32

Length:

60 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Maximum Seated Height:

8.2 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

34.8 mm

Trade Compliance

FSAM10SM60A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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