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FSA801UMX

Onsemi

FSA801UMX by Onsemi

FSA801UMX by Onsemi is a 16-terminal audio/video switch with a max on-state resistance of 9 ohm. Operating temperature ranges from -40 to 85 °C, making it suitable for industrial applications. With a terminal pitch of 0.4 mm and surface mount capability, this chip carrier is ideal for compact electronic designs.

Median Price

$0.548

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

$0.528

1k+ parts

$0.439

10k+ parts

$0.391

60,000

-

$0.528

$0.439

$0.391

DigiKey

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.660

10k+ parts

-

60,000

-

-

$0.660

-

Verical

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.548

10k+ parts

$0.489

35,000

-

-

$0.548

$0.489

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,054 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

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1,054

$0.411

-

-

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Vyrian

USA . 47,046 parts In-Stock

1+ parts

-

100+ parts

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47,046

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-

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ACDS - Activité Composants Distribution Service

France . 4,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,900

-

-

-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 47,372 parts In-Stock

1+ parts

$0.368

100+ parts

-

1k+ parts

-

10k+ parts

-

47,372

$0.368

-

-

-

Corphita

USA . 2,918 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,918

$0.390

-

-

-

Corohmni

South Africa . 102 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$0.433

-

-

-

Semicontronic

India . 47,177 parts In-Stock

1+ parts

$0.800

100+ parts

$0.780

1k+ parts

$0.776

10k+ parts

-

47,177

$0.800

$0.780

$0.776

-

Aztec Data Supply Inc.

USA . 2,258 parts In-Stock

1+ parts

$15.250

100+ parts

-

1k+ parts

-

10k+ parts

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2,258

$15.250

-

-

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Metaverse IC Inc.

Canada . 36,530 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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36,530

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Perfect Parts

USA . 21,371 parts In-Stock

1+ parts

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21,371

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QUARKTWIN TECHNOLOGY LTD

USA . 18,373 parts In-Stock

1+ parts

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100+ parts

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18,373

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A-Z Elektronik GmbH

Germany . 7,079 parts In-Stock

1+ parts

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100+ parts

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7,079

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

1+ parts

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6,500

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Kepictronics

USA . 5,500 parts In-Stock

1+ parts

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5,500

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-

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Kulean Microsystems

USA . 5,196 parts In-Stock

1+ parts

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5,196

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-

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Cyclops Electronics Ltd (Excess)

UK . 4,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,900

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-

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Alle Elektronik GmbH

Germany . 4,719 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,719

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Microchip USA

USA . 4,385 parts In-Stock

1+ parts

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4,385

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SupplyDigital Components

Austria . 4,241 parts In-Stock

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4,241

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Supply Digital

USA . 2,530 parts In-Stock

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2,530

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Argo Parts USA

USA . 2,053 parts In-Stock

1+ parts

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2,053

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Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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900

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Continental Prestige Electronics

USA . 528 parts In-Stock

1+ parts

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528

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Problanco Electronics

Mexico . 474 parts In-Stock

1+ parts

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474

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UHIMA Technologies

Türkiye . 153 parts In-Stock

1+ parts

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153

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TANS Electronics

Latvia . 12 parts In-Stock

1+ parts

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100+ parts

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12

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Overview

Upgrade your audio/video switching experience with the FSA801UMX by Onsemi. Designed for industrial-grade applications, this multiplexer offers high-quality performance with a very thin profile chip carrier package. With three channels and a low on-state resistance of 9 ohms, this product provides seamless signal switching while consuming minimal power at just 0.035mA. Trust in Onsemi's reputation for excellence and elevate your projects with the FSA801UMX.

Feature Benefit Bullets

Surface Mount YES:

The surface mount feature allows for easy and efficient installation, making this product a convenient choice.

Package Shape RECTANGULAR:

The rectangular package shape helps save space and allows for efficient circuit board layout.

Power Supplies (V) 2.7/4.4:

This product can operate within a wide range of power supplies, providing flexibility in different applications.

No. of Terminals 16:

With 16 terminals, this product offers multiple connection options for a variety of devices.

Package Style (Meter) CHIP CARRIER, VERY THIN PROFILE:

The chip carrier style with a very thin profile ensures space-saving and lightweight design.

Maximum Operating Temperature 85 °C:

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature -40 °C:

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish NICKEL PALLADIUM GOLD:

The nickel palladium gold terminal finish provides durable and reliable connections for long-lasting usage.

Terminal Position QUAD:

The quad terminal position offers efficient signal routing and connectivity options for enhanced performance.

Maximum Seated Height 0.55 mm:

The maximum seated height of 0.55 mm allows for compact and low-profile installations.

Width (mm) 1.8 mm:

With a narrow width of 1.8 mm, this product is suitable for space-constrained applications.

Other IC type AUDIO/VIDEO SWITCH:

The audio/video switch functionality adds versatility to this product, making it suitable for multimedia applications.

Maximum Time At Peak Reflow Temperature (s) 30:

The maximum time at peak reflow temperature of 30 seconds ensures safe and efficient soldering processes.

Peak Reflow Temperature °C 260:

The peak reflow temperature of 260°C allows for high-temperature soldering without compromising the product's integrity.

Maximum On-state Resistance (Ron) 9 ohm:

The low on-state resistance of 9 ohms ensures minimal signal loss and optimal performance.

Length 2.6 mm:

The compact length of 2.6 mm contributes to the overall space-saving design of this product.

Temperature Grade INDUSTRIAL:

The industrial temperature grade ensures reliable operation in challenging industrial environments.

Maximum Supply Current (Isup) 0.035 mA:

With a maximum supply current of 0.035 mA, this product offers energy-efficient operation.

No. of Channels 3:

The three channels provide multiple signal routing options, making this product suitable for complex applications.

Terminal Form NO LEAD:

The no-lead terminal form enhances reliability and simplifies soldering processes for easy installation.

Terminal Pitch 0.4 mm:

The small terminal pitch of 0.4 mm allows for high-density mounting, making this product ideal for compact devices.

Technical Specifications

Multiplexers & Switches FSA801UMX attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum On-state Resistance (Ron):

9 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.07X.1,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7/4.4

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.035 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.8 mm

Trade Compliance

FSA801UMX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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