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FS6131-01I-XTP

Onsemi

FS6131-01I-XTP by Onsemi

FS6131-01I-XTP by Onsemi is a PLL Frequency Synthesizer with 16 terminals, operating at -40 to 85 °C. It has a supply voltage range of 4.5V to 5.5V and uses CMOS technology. This rectangular package is ideal for industrial applications requiring precise frequency synthesis in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,035 parts In-Stock

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Vyrian

USA . 729 parts In-Stock

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729

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Native Components

USA . 423 parts In-Stock

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$0.040

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$0.038

Kulean Microsystems

USA . 5,191 parts In-Stock

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TANS Electronics

Latvia . 2,765 parts In-Stock

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Northwest PG Solutions

USA . 2,081 parts In-Stock

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Problanco Electronics

Mexico . 1,469 parts In-Stock

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Corphita

USA . 908 parts In-Stock

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SupplyDigital Components

Austria . 750 parts In-Stock

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Corohmni

South Africa . 307 parts In-Stock

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UHIMA Technologies

Türkiye . 265 parts In-Stock

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Overview

Unlock precision and reliability with the FS6131-01I-XTP by Onsemi. This Phase Locked Loop (PLL) & Frequency Synthesis Circuits are designed to meet the highest industry standards, providing seamless integration into a wide range of applications. With Onsemi's reputation for excellence in manufacturing, customers can trust in the quality and performance of this product. Experience unparalleled value and efficiency with the FS6131-01I-XTP, offering superior functionality and versatility for all your frequency synthesis needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes it compatible with many systems and easier to integrate.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components in a circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable performance even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB design and facilitate efficient routing of connections.

Width (mm): 3.9 mm

The compact width of 3.9 mm saves space on the PCB, especially in applications where board real estate is limited.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a low minimum supply voltage of 4.5V can be advantageous in power-sensitive applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product meets stringent requirements for reliability and performance in harsh environments.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits FS6131-01I-XTP attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

Length:

9.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

FS6131-01I-XTP Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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