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FOD8480TR2

Onsemi

FOD8480TR2 by Onsemi

FOD8480TR2 by Onsemi is a single optocoupler with max. forward current of 0.02A, operating temp. range -40 to 100 °C, and isolation voltage of 5000V. Ideal for logic IC output applications, it features surface mounting and matte tin terminal finish.

Median Price

$3.116

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 527 parts In-Stock

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$3.116

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Vyrian

USA . 4,360 parts In-Stock

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Native Components

USA . 684 parts In-Stock

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$0.619

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Northwest PG Solutions

USA . 1,063 parts In-Stock

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$0.681

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Corphita

USA . 581 parts In-Stock

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$2.952

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Corohmni

South Africa . 324 parts In-Stock

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$3.280

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324

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QUARKTWIN TECHNOLOGY LTD

USA . 27,351 parts In-Stock

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Problanco Electronics

Mexico . 5,736 parts In-Stock

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Kulean Microsystems

USA . 5,022 parts In-Stock

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SupplyDigital Components

Austria . 3,438 parts In-Stock

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TANS Electronics

Latvia . 1,663 parts In-Stock

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UHIMA Technologies

Türkiye . 367 parts In-Stock

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Overview

Experience superior quality and reliability with the FOD8480TR2 optocoupler circuit outputs by Onsemi. With a trusted manufacturer like Onsemi, you can expect top-notch performance and durability in your applications. This single configuration optocoupler offers a maximum forward current of 0.02 A, making it ideal for a wide range of projects. From logic IC output to surface mounting features, this product provides value and benefits to customers looking for a dependable solution. Upgrade your electronics with the FOD8480TR2 and enjoy peace of mind knowing you have a high-quality product at your disposal.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into a circuit without the need for additional components.

Maximum Forward Current: 0.02 A

Capable of handling up to 0.02 A of forward current, providing flexibility in different applications.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Logic IC output optocoupler ensures precise signal transmission between different parts of a circuit.

Minimum Supply Voltage: 4.5 V

Operates efficiently with a minimum supply voltage of 4.5 V, making it suitable for a wide range of systems.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures of up to 100 °C, ensuring reliability in demanding environments.

Minimum Operating Temperature: -40 °C

Functions effectively even at low temperatures as low as -40 °C, suitable for use in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good conductivity and durability for long-lasting performance.

Packing Method: TR

TR packing method ensures safe transportation and handling of the product during shipping and storage.

Maximum Isolation Voltage: 5000 V

Provides high isolation voltage of 5000 V, enhancing safety and reducing risks of electrical interference.

Mounting Feature: SURFACE MOUNT

Surface mounting feature simplifies the installation process and saves space on the circuit board.

Maximum On State Current: 0.025 A

Capable of handling a maximum on state current of 0.025 A, ensuring reliable performance under varying load conditions.

Technical Specifications

Optocoupler Circuit Outputs FOD8480TR2 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.02 A

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.025 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR

Minimum Supply Voltage:

4.5 V

Terminal Finish:

Trade Compliance

FOD8480TR2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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