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FNB40560B2

Onsemi

FNB40560B2 by Onsemi

FNB40560B2 by Onsemi is a Motion Control IC with 26 terminals, operating voltage range of 13.5V to 16.5V, and max output current of 7.5A. This AC Motor Controller in rectangular package is ideal for applications requiring precise motor control in compact spaces.

Median Price

$10.450

Lifecycle Status

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DigiKey

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Corohmni

South Africa . 297 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Overview

Enhance your motion control applications with the FNB40560B2 from Onsemi, a leading manufacturer known for top-quality products. Designed for AC motor controllers, this IC offers superior performance and reliability. With a nominal supply voltage of 15V and a maximum output current of 7.5A, this versatile component ensures smooth operation in a compact package. Upgrade your projects with the FNB40560B2 and experience the benefits of precision control and efficient power management. Elevate your designs with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, which is ideal for applications where weight and reliability are important factors.

Nominal Supply Voltage (Vsup): 15 V

The nominal supply voltage of 15V ensures compatibility with a wide range of power sources and allows for efficient operation of the motion control ICs.

No. of Terminals: 26

With 26 terminals, this motion control IC can accommodate a wide range of input and output connections, making it versatile and suitable for various applications.

Terminal Finish: TIN

The tin terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Maximum Output Current: 7.5 A

With a maximum output current of 7.5A, this motion control IC can drive high-power motors and components, making it suitable for demanding applications.

Technical Specifications

Motion Control ICs FNB40560B2 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T26

JESD-609 Code:

e3

Length:

39 mm

No. of Functions:

1

No. of Terminals:

26

Maximum Output Current:

7.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

7.5 mm

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Width (mm):

23 mm

Trade Compliance

FNB40560B2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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